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Institution	Date	Title	Author
義守大學	1999	IC用特用化學品---微電子元件塑膠封膠材之研究---子計畫IV：微電子元件封裝之封膠過程中金線變形之熱黏塑性分析(III)	葉南銘
義守大學	1996	中介層及冷卻路徑對長纖金屬複合材料殘餘應力之影響	葉南銘
義守大學	1995	長纖金屬複合材料的雙模式黏塑性理論	葉南銘

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