臺大學術典藏 |
2018-09-10T09:25:10Z |
Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes
|
C.-D. Wang;Y.-M. Yu;F. d. Paulis;A. C. Scogna;A. Orl;i;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU |
臺大學術典藏 |
2018-09-10T09:25:10Z |
Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes
|
C.-D. Wang;Y.-M. Yu;F. d. Paulis;A. C. Scogna;A. Orl;i;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU |
臺大學術典藏 |
2018-09-10T08:18:41Z |
Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure
|
A. C. Scogna;C.-D. Wang;A. Orl;i;T.-L. Wu; A. C. Scogna; C.-D. Wang; A. Orl; i; T.-L. Wu; TZONG-LIN WU |
臺大學術典藏 |
2018-09-10T08:18:41Z |
Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure
|
A. C. Scogna;C.-D. Wang;A. Orl;i;T.-L. Wu; A. C. Scogna; C.-D. Wang; A. Orl; i; T.-L. Wu; TZONG-LIN WU |
臺大學術典藏 |
2018-09-10T08:18:40Z |
Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology
|
T.-L. Wu;J. Fan;F. d. Paulis;C.-D. Wang;A. C. Scogna;A. Orl;i; T.-L. Wu; J. Fan; F. d. Paulis; C.-D. Wang; A. C. Scogna; A. Orl; i; Wu, Tzong-Lin |
臺大學術典藏 |
2018-09-10T08:18:40Z |
Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology
|
T.-L. Wu;J. Fan;F. d. Paulis;C.-D. Wang;A. C. Scogna;A. Orl;i; T.-L. Wu; J. Fan; F. d. Paulis; C.-D. Wang; A. C. Scogna; A. Orl; i; Wu, Tzong-Lin |