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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
研討會
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Institution Date Title Author
臺大學術典藏 2018-09-10T09:50:40Z Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression C.-D. Wang;T.-L. Wu; C.-D. Wang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:50:40Z ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments YI-CHANG LU; TZONG-LIN WU; YIH-PENG CHIOU; Y.-P. Chiou; T.-L. Wu; P.-S. Chen; W.-C. Lo; Y.-C. Lu; C.-D. Wang;Y.-J. Chang;Y.-C. Lu;P.-S. Chen;W.-C. Lo;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-J. Chang
臺大學術典藏 2018-09-10T09:25:10Z Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes C.-D. Wang;Y.-M. Yu;F. d. Paulis;A. C. Scogna;A. Orl;i;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏 2018-09-10T09:25:10Z A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method YIH-PENG CHIOU; T.-Y. Cheng;C.-D. Wang;Y.-P. Chiou;T.-L. Wu; T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T08:46:52Z Accuracy-improved through-silicon-via model using conformal mapping technique T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏 2018-09-10T08:46:51Z Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP C.-D. Wang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T08:46:50Z Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules C.-Y. Hsiao; C.-H. Huang; C.-D. Wang; K.-H. Liao; C.-H. Shen; C.-C. Wang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T08:18:42Z A stopband enhanced EBG power/ground plane based on via location design C.-D. Wang;T.-L. Wu; C.-D. Wang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T08:18:42Z Conformal shielding investigation for SiP modules C.-H. Huang;C.-Y. Hsiao;C.-D Wang;T. Chen;K.-H. Liao;T.-L. Wu; C.-H. Huang; C.-Y. Hsiao; C.-D Wang; T. Chen; K.-H. Liao; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T08:18:41Z Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure A. C. Scogna;C.-D. Wang;A. Orl;i;T.-L. Wu; A. C. Scogna; C.-D. Wang; A. Orl; i; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T08:18:40Z Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology T.-L. Wu;J. Fan;F. d. Paulis;C.-D. Wang;A. C. Scogna;A. Orl;i; T.-L. Wu; J. Fan; F. d. Paulis; C.-D. Wang; A. C. Scogna; A. Orl; i; Wu, Tzong-Lin
國立聯合大學 2008 Lateral stresses caused by uniform rectangular area loads on a cross-anisotropic backfill C. D. Wang
國立聯合大學 2007 Lateral Force and Centroid Location Caused by Horizontal and Vertical Surcharge Strip Loads on a Cross-Anisotropic Backfill C. D. Wang
國立聯合大學 2007 Lateral Force Induced by Rectangular Surcharge Loads on a Cross-Anisotropic Backfill C. D. Wang
國立聯合大學 2004 Three-Dimensional Non-linearly Varying Rectangular Loads on a Transversely Isotropic Half-Space C. D. Wang
國立聯合大學 2003 Displacements and Stresses Due to a Vertical Subsurface Loading for Cross-Anisotropic Half-Spaces C.D. Wang
國立聯合大學 2003 Three-Dimensional Non-linearly Varying Rectangular Loads on a Transversely Isotropic Half-Space C.D. Wang

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