English  |  正體中文  |  简体中文  |  Total items :2822924  
Visitors :  30035705    Online Users :  1055
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
About TAIR

Browse By

News

Copyright

Related Links

"c h chien"

Return to Browse by Author
Sorting by Title Sort by Date

Showing items 26-50 of 78  (4 Page(s) Totally)
<< < 1 2 3 4 > >>
View [10|25|50] records per page

Institution Date Title Author
國立中山大學 2006-06-04 Adhesion features of bonded interfaces interpreted by Taguchi technique C.H. Chien; T.P. Chen; C.C. Hsieh
國立中山大學 2006-06-04 Experimental Analysis of Thermal Deformation Effects o?n LCD Backlight Module C.H. Chien; C.T. Tsai; Y.M. Tzeng; C.C. Hsieh; M.L. Tsai
中原大學 2006 Biomechanical evaluation of using iliac bone or rib bone graft in anterior T12-L1 interbody fusion and effect of triangulation of the anterior fixation screws C. H. Chien;W. P. Chen;T. J. Huang;C. Y. Lin
中原大學 2006 Finite element analysis of four different lumbar interbody fusion cage designs W. P. Chen;C. Y. Lin;S. H. Chen;C. H. Chien
國立中山大學 2006 Nanoscale Deformation Measurement using the Gray-level Method by Holographic Interferometry C.H. Chien; Y.D. Wu; Y.T. Chiou; C.C. Hsieh; Y.C. Chen; T.P. Chen; M.L. Tsai; C.T. Wang
國立中山大學 2006 Stability of the warpage in a PBGA package subjected to hygro-thermal loading C.H. Chien; T.P. Chen; Y.C. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立高雄第一科技大學 2005.12 Potential Exposure to VOCs Caused by Dry Process Photocopiers: Results From a Chamber Study. D.-J.Hsu;H.-L.Huang;C.-H.Chien;T.-S.Lin
國立中山大學 2005-05 Analytical Study of Thermal Modeling and Thermal Stress for Friction Stir Welding C.H. Chien; T.P. Chen; Y.J. Chao
國立中山大學 2005 Thermal Modeling and Optimal Tool Moving Velocity for Friction Stir Welding C.H. Chien; T.P. Chen; Y.J. Chao
國立中山大學 2005 Study on The Geometry of Microball Lens Array by Novel Batch-fabrication Technique C.H. Chien; C.T. Pan; C.C. Hsieh; C.M. Yang; K.L. Sher
國立中山大學 2005 A study of the geometry of microball lens arrays using the novel batch-fabrication technique C.H. Chien; C.T. Pan; C.C. Hesieh
國立中山大學 2005 An interfacial investigation of high dielectric constant material hafnium oxide on Si substrate S.C. Chen;J.C. Lou;C.H. Chien;P.T. Liu;T.C. Chang
國立高雄第一科技大學 2004.04 Thermomechanical Behavior of Underfill/Solder Mask/Substrate Interface UnderThermal Cycling C.-H.Chien;Y.-C.Chen, C.-C;Hsieh, Y.-T.;Chiou;Y.-D.Wu;Chen, T.-R; 謝其昌
國立中山大學 2004-12 The Packaging Process of Metal Microcap under Room Temperature Status and Its Shear Stress-Strain Relationship Analysis C.H. Chien; C.T. Pan; C.M. Yang; C.C. Hsieh
國立中山大學 2004-12 Thermal Modeling and Optimal Tool Moving Velocity for Friction Stir Welding C.H. Chien; T.P. Chen; Y.J. Chao
國立中山大學 2004-08 Nanoscale Measurement with Microscale Surface Resolution by Holographic Interferometry C.H. Chien; Y.D. Wu; C.C. Hsieh; Y.C. Chen; T.P. Chen; C.T. Wang
中國醫藥大學 2004-07-11 Genotoxicity of aristolochic acid in mice and in vitro (C.H. Chien); (H.C. Wan); (H.C. Chen); (J.G. Lin); (T.T. Kao); 江素瑛(Su-yin Chiang)
國立中山大學 2004-06-07 Investigations of the Mixed-mode Fracture of IC Package Interfaces C.H. Chien;Y.C. Chen; C.C. Hsieh; M.Y. Huang; Y.D. Wu; T.P. Chen
國立中山大學 2004-06-07 The Effect of Moisture o?n Adhesion Features of the Underfill/solder mask/substrate Joint C.H. Chien; C.C. Hsieh; Y.C. Chen; Y.D. Wu
國立中山大學 2004-06-05 Hygro-Thermal Buckling And Warpage of An Initial Perfect Thin PBGA Package T.P. Chen; C.H. Chien
國立中山大學 2004-05-16 Hygro-Thermal Buckling Of A Thin PBGA Package C.H. Chien; T.P. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu; C.T. Wang
國立中山大學 2004-03 Study of Thermal and Heat Transfer Phenomenon in Friction Stir Welding of Aluminum Alloy 6061-T6 Thick Plates S. Liu; Y.J. Chao; C.H. Chien
國立中山大學 2004 Numerical Method to Predict and Fabricate Aspherical Micro-lens Array Using 248nm Excimer Laser Ablation C.T. Pan; S.C. Shen; C.C. Hsieh; C.H. Chien; Y.C. Chen
國立中山大學 2004 Technique of Microball Lens Formation for Efficient Optical Coupling C.T. Pan; C.H. Chien; C.C. Hsieh
國立中山大學 2004 Thermo-mechanical Behaviors of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou

Showing items 26-50 of 78  (4 Page(s) Totally)
<< < 1 2 3 4 > >>
View [10|25|50] records per page