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Institution	Date	Title	Author
國立中山大學	2004-08	Nanoscale Measurement with Microscale Surface Resolution by Holographic Interferometry	C.H. Chien; Y.D. Wu; C.C. Hsieh; Y.C. Chen; T.P. Chen; C.T. Wang
中國醫藥大學	2004-07-11	Genotoxicity of aristolochic acid in mice and in vitro	(C.H. Chien); (H.C. Wan); (H.C. Chen); (J.G. Lin); (T.T. Kao); 江素瑛(Su-yin Chiang)
國立中山大學	2004-06-07	Investigations of the Mixed-mode Fracture of IC Package Interfaces	C.H. Chien;Y.C. Chen; C.C. Hsieh; M.Y. Huang; Y.D. Wu; T.P. Chen
國立中山大學	2004-06-07	The Effect of Moisture o?n Adhesion Features of the Underfill/solder mask/substrate Joint	C.H. Chien; C.C. Hsieh; Y.C. Chen; Y.D. Wu
國立中山大學	2004-06-05	Hygro-Thermal Buckling And Warpage of An Initial Perfect Thin PBGA Package	T.P. Chen; C.H. Chien
國立中山大學	2004-05-16	Hygro-Thermal Buckling Of A Thin PBGA Package	C.H. Chien; T.P. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu; C.T. Wang
國立中山大學	2004-03	Study of Thermal and Heat Transfer Phenomenon in Friction Stir Welding of Aluminum Alloy 6061-T6 Thick Plates	S. Liu; Y.J. Chao; C.H. Chien
國立中山大學	2004	Numerical Method to Predict and Fabricate Aspherical Micro-lens Array Using 248nm Excimer Laser Ablation	C.T. Pan; S.C. Shen; C.C. Hsieh; C.H. Chien; Y.C. Chen
國立中山大學	2004	Technique of Microball Lens Formation for Efficient Optical Coupling	C.T. Pan; C.H. Chien; C.C. Hsieh
國立中山大學	2004	Thermo-mechanical Behaviors of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling	C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學	2003-06-02	Investigation of the Adhesion Strength of Underfill/Solder Mask/Substrate Joints Under Thermal Cycling	C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學	2003-06	Nano-scale Measurement using the Direct Gray-level Method by Holographic Interferometry	C.H. Chien; Y.D. Wu; Y.C. Chen; C.C. Hsieh; Y.T. Chiou
國立中山大學	2003	Influences of the Moisture Absorption on PBGA Package's Warpage During IR Reflow Process	C.H. Chien; Y.C. Chen; Y.T. Chiou; T.P. Chen; C.C. Hsieh; J.J. Yan; W.Z. Chen; Y.D. Wu
國立中山大學	2002	The Measurement of Interfacial Strength of IC Package by Moire Interferometry	C.H. Chien; W.Y. Lin; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立中山大學	2002	The effect of moisture o?n the interfacial adhesion of IC packages	C.H. Chien; D.J. Weng; Y.T. Chiou; M.L. Tsai; Y.C. Chen
國立中山大學	2000-06-05	Warpage Measurements of IC Package During The IR-reflow Process	C.H. Chien; Y.T. Chiou; M.L.Tsai; T.C. Hung
國立中山大學	1998	The quantitative analysis of a two-medium mixture using holographic interferometry: the determination of the size corresponding to circular- and rectangular-column voids in a two-medium mixture	C.H. Chien; Y.T. Chiou; C.C. Lee; Y.W. Liou; S.T. Chen
國立中山大學	1997	The study of Residual stress Effect on the Mode I Stress Intensity Factor in AL 6061-T6 Aluminum Plate by the Reflected Shadow Method	C.H. Chien; Y.T. Chiou
國立中山大學	1997	Extending the Laser- Specklegram Technigue to Residual Displacement Analysis of Weldment	C.H. Chien; Y.T. Chiou
國立中山大學	1997	lnspection of plates with Regions of Local Thirming as Defects by Hybrid Method of HoIographic lnterferometry and Finite Element Method	C.H. Chien; Y.T. Chion; M.C. Jong
國立中山大學	1996	The Application of Two-Refiactive-Index Contouring on the Contour Difference of Two Compared Specimens	C.H. Chien;Y.T. Chiou;L.H. Lin
國立中山大學	1995-11	The Reflected Shadow Method for the Study of the Stress lntensity Factor in Aluminum Plate with Residual Stress	Y.T. Chiou; C.H. Chien
國立中山大學	1994-11	The Application of Two-Refractive-Index Contouring o?n the Contour Difference of Two Compared Specimens	L.H. Lin; Y.T. Chiou; C.H. Chien
國立中山大學	1993-12	The Effects of Punch-Die Clearence o?n Blanking Process Parameters for Different Material Supporting Methods	C.C. Chien; L.H. Lin; C.H. Chien
國立中山大學	1993	界面電阻或熱阻之模擬	錢志回; 法敏; 魏蓬生; C.H. Chien; S.A. Fomin; P.S. Wei

Showing items 41-65 of 78 (4 Page(s) Totally)
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