臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
國立中山大學	2005	A study of the geometry of microball lens arrays using the novel batch-fabrication technique	C.H. Chien; C.T. Pan; C.C. Hesieh
國立中山大學	2005	An interfacial investigation of high dielectric constant material hafnium oxide on Si substrate	S.C. Chen;J.C. Lou;C.H. Chien;P.T. Liu;T.C. Chang
國立高雄第一科技大學	2004.04	Thermomechanical Behavior of Underfill/Solder Mask/Substrate Interface UnderThermal Cycling	C.-H.Chien;Y.-C.Chen, C.-C;Hsieh, Y.-T.;Chiou;Y.-D.Wu;Chen, T.-R; 謝其昌
國立中山大學	2004-12	The Packaging Process of Metal Microcap under Room Temperature Status and Its Shear Stress-Strain Relationship Analysis	C.H. Chien; C.T. Pan; C.M. Yang; C.C. Hsieh
國立中山大學	2004-12	Thermal Modeling and Optimal Tool Moving Velocity for Friction Stir Welding	C.H. Chien; T.P. Chen; Y.J. Chao
國立中山大學	2004-08	Nanoscale Measurement with Microscale Surface Resolution by Holographic Interferometry	C.H. Chien; Y.D. Wu; C.C. Hsieh; Y.C. Chen; T.P. Chen; C.T. Wang
中國醫藥大學	2004-07-11	Genotoxicity of aristolochic acid in mice and in vitro	(C.H. Chien); (H.C. Wan); (H.C. Chen); (J.G. Lin); (T.T. Kao); 江素瑛(Su-yin Chiang)
國立中山大學	2004-06-07	Investigations of the Mixed-mode Fracture of IC Package Interfaces	C.H. Chien;Y.C. Chen; C.C. Hsieh; M.Y. Huang; Y.D. Wu; T.P. Chen
國立中山大學	2004-06-07	The Effect of Moisture o?n Adhesion Features of the Underfill/solder mask/substrate Joint	C.H. Chien; C.C. Hsieh; Y.C. Chen; Y.D. Wu
國立中山大學	2004-06-05	Hygro-Thermal Buckling And Warpage of An Initial Perfect Thin PBGA Package	T.P. Chen; C.H. Chien
國立中山大學	2004-05-16	Hygro-Thermal Buckling Of A Thin PBGA Package	C.H. Chien; T.P. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu; C.T. Wang
國立中山大學	2004-03	Study of Thermal and Heat Transfer Phenomenon in Friction Stir Welding of Aluminum Alloy 6061-T6 Thick Plates	S. Liu; Y.J. Chao; C.H. Chien
國立中山大學	2004	Numerical Method to Predict and Fabricate Aspherical Micro-lens Array Using 248nm Excimer Laser Ablation	C.T. Pan; S.C. Shen; C.C. Hsieh; C.H. Chien; Y.C. Chen
國立中山大學	2004	Technique of Microball Lens Formation for Efficient Optical Coupling	C.T. Pan; C.H. Chien; C.C. Hsieh
國立中山大學	2004	Thermo-mechanical Behaviors of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling	C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學	2003-06-02	Investigation of the Adhesion Strength of Underfill/Solder Mask/Substrate Joints Under Thermal Cycling	C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou
國立中山大學	2003-06	Nano-scale Measurement using the Direct Gray-level Method by Holographic Interferometry	C.H. Chien; Y.D. Wu; Y.C. Chen; C.C. Hsieh; Y.T. Chiou
國立中山大學	2003	Influences of the Moisture Absorption on PBGA Package's Warpage During IR Reflow Process	C.H. Chien; Y.C. Chen; Y.T. Chiou; T.P. Chen; C.C. Hsieh; J.J. Yan; W.Z. Chen; Y.D. Wu
國立中山大學	2002	The Measurement of Interfacial Strength of IC Package by Moire Interferometry	C.H. Chien; W.Y. Lin; Y.T. Chiou; C.C. Hsieh; Y.D. Wu
國立中山大學	2002	The effect of moisture o?n the interfacial adhesion of IC packages	C.H. Chien; D.J. Weng; Y.T. Chiou; M.L. Tsai; Y.C. Chen
國立中山大學	2000-06-05	Warpage Measurements of IC Package During The IR-reflow Process	C.H. Chien; Y.T. Chiou; M.L.Tsai; T.C. Hung
國立中山大學	1998	The quantitative analysis of a two-medium mixture using holographic interferometry: the determination of the size corresponding to circular- and rectangular-column voids in a two-medium mixture	C.H. Chien; Y.T. Chiou; C.C. Lee; Y.W. Liou; S.T. Chen
國立中山大學	1997	The study of Residual stress Effect on the Mode I Stress Intensity Factor in AL 6061-T6 Aluminum Plate by the Reflected Shadow Method	C.H. Chien; Y.T. Chiou
國立中山大學	1997	Extending the Laser- Specklegram Technigue to Residual Displacement Analysis of Weldment	C.H. Chien; Y.T. Chiou
國立中山大學	1997	lnspection of plates with Regions of Local Thirming as Defects by Hybrid Method of HoIographic lnterferometry and Finite Element Method	C.H. Chien; Y.T. Chion; M.C. Jong

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