臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	Repositories
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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	機構典藏計畫網站
	ROAR
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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
元智大學	Sep-19	Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures	C. H. Yang; Y. W. Lee; C. Y. Lee; C. H. Chang; Cheng-En Ho
元智大學	Oct-16	High Dispersion of 1-nm SnO2 Particles between Graphene Nanosheets Constructed Using Supercritical CO2 Fluid for Sodium-ion Battery Anodes	J. Patra; H.C. Chen; C.H. Yang; C.Y. Su; Chien-Te Hsieh; J.K. Chang
元智大學	May-20	Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations	Cheng-En Ho; C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee
元智大學	May-20	Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations	C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee; Cheng-En Ho
元智大學	May-19	Effect of pulse-reverse plating on copper: thermal mechanical properties and microstructure relationship	B. C. Huang; C. H. Yang; C. Y. Lee; Y. L. Hu; C. C. Hsu; Cheng-En Ho
元智大學	Mar-20	Significantly Improving the Etching Characteristics of Electroplated Cu Films through Microstructure Modification	C. Y. Lee; P. C. Lin; C. H. Yang; Cheng-En Ho
元智大學	Mar-16	Real-time X-ray microscopy study of electromigration in microelectronic solder joints	Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學	Mar-16	Real-time X-ray microscopy study of electromigration in microelectronic solder joints	Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學	Mar-16	Real-time X-ray microscopy study of electromigration in microelectronic solder joints	Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學	Jun-19	Nanoindentation Study of Single-Crystalline and (101)-Oriented Nanotwinned Cu	C. H. Yang; C. Y. Lee; B. C. Huang; P. C. Lin; Cheng-En Ho
元智大學	Dec-15	Formation Mechanism of Pinholes in Electroplated Cu Films and Its Mitigation	C. C. Chen; C. H. Hsieh; Y. W. Lee; C. H. Yang; Cheng-En Ho
元智大學	Dec-15	Abnormal Depletion of Cu Metallization Pads in Line-bump-line Solder Joints under Electron Current Stressing	Cheng-En Ho; C. H. Yang; C. T. Chen; B. Z. Chen
元智大學	Aug-20	Influence of Pd(P) Thickness on the Pd-free Solder Reaction between Eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu Multilayer	C. Y. Lee; S. P. Yang; C. H. Yang; M. K. Lu; T. T. Kuo; Cheng-En Ho
元智大學	Apr-19	In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage	C. H. Yang; S. P. Yang; B. C. Huang; C. Y. Lee; H. C. Liu; Cheng-En Ho
元智大學	Apr-17	Eco-efficient Synthesis of Highly Porous CoCO3 Anodes for Li+ and Na+ Storage Using Supercritical CO2 Precursors	H.-Y. Li; C.-M. Tseng; C.-H. Yang; T.-C. Lee; C.-Y. Su; Chien-Te Hsieh; J.K. Chang
元智大學	Apr-16	Facile Electrochemical Preparation of Hierarchical Porous Structures to Enhance Manganese Oxide Charge-Storage Properties in Ionic Liquid Electrolytes	C.-H. Yang; I-W. Sun; Chien-Te Hsieh; T.-Y. Wu; C.-Y. Su; J.-K. Chang
臺大學術典藏	2021-12-06T09:02:53Z	The analyses and verification of in-vivo animal tests on the CMOS bone-guided cochlear implant microsystem	X.H. Qian; Y.C. Wu; T.Y. Yang; C.H. Cheng; H.C. Chu; W.H. Cheng; T.Y. Yen; T.H. Lin; Y.J. Lin; Y.C. Lee; J.H. Chang; S.T. Lin; S.H. Li; T.C. Wu; C.C. Huang; C.F. Lee; C.H. Yang; C.C. Hung; T.S. Chi; C.H. Liu; M.D. Ker; C.Y. Wu; CHIEN-HAO LIU
臺大學術典藏	2020-10-07T01:24:51Z	Microvascular imaging using swept-source optical coherence tomography with single-channel acquisition	M-T Tsai;T-D Chi;H-L Liu;F-Y Chang;C-H Yang;C-K Lee;C-C Yang; M-T Tsai; T-D Chi; H-L Liu; HAO-LI LIU; 劉浩澧; C-K Lee; C-C Yang; F-Y Chang; C-H Yang; H-L Liu; T-D Chi; F-Y Chang; C-H Yang; C-K Lee; C-C Yang; HAO-LI LIU; M-T Tsai
元智大學	2019/11/15	White X-ray Laue Diffraction Characterization of Microstructure Transition and Stress Relaxation of Electroplating Cu upon Self-annealing	Y. H. Huang; W. Z. Hsieh; C. Y. Lee; C. H. Yang; S. J. Chiu; C. S. Ku; Cheng-En Ho
元智大學	2019/11/15	White X-ray Laue Diffraction Characterization of Microstructure Transition and Stress Relaxation of Electroplating Cu upon Self-annealing	Y. H. Huang; W. Z. Hsieh; C. Y. Lee; C. H. Yang; S. J. Chiu; C. S. Ku; Cheng-En Ho
元智大學	2019/10/23	Microstructure Modification of Electroplating Cu and Improvement of Its Etching Characteristics in the Roughening Process	C. Y. Lee; P. C. Lin; C. H. Yang; H. C. Liu; K. H. Lan; Cheng-En Ho
臺大學術典藏	2019-10-31T07:45:04Z	A 1-V 2.6-mW Environmental Compensated Fully Integrated Nose-on-a-Chip	CHIA-HSIANG YANG;K.-T. Tang;M.-F. Chang;C.-C. Hsieh;H. Chen;H. Chiueh;C.-H. Yang;G. Wang;S.-W. Chiu;J.-Y. Jhang;K.-H. Chang;T.-I Chou; T.-I Chou; K.-H. Chang; J.-Y. Jhang; S.-W. Chiu; G. Wang; C.-H. Yang; H. Chiueh; H. Chen; C.-C. Hsieh; M.-F. Chang; K.-T. Tang; CHIA-HSIANG YANG
臺大學術典藏	2019-10-31T07:45:03Z	An Area-Efficient Multi-Mode LLR Computing Engine for MMSE-Based MIMO Detectors	CHIA-HSIANG YANG;Y.-L. Ueng;C.-H. Yang;W.-C. Sun; W.-C. Sun; C.-H. Yang; Y.-L. Ueng; CHIA-HSIANG YANG
臺大學術典藏	2019-10-31T07:45:03Z	A 501mW 7.61Gb/s Integrated Message-Passing Detector and Decoder for Polar-Coded Massive MIMO Systems	CHIA-HSIANG YANG;C.-H. Yang;Y.-L. Ueng;W.-C. Sun;T.-L. Tsai;C.-C. Cheng;Y.-T. Chen; Y.-T. Chen; C.-C. Cheng; T.-L. Tsai; W.-C. Sun; Y.-L. Ueng; C.-H. Yang; CHIA-HSIANG YANG
臺大學術典藏	2019-10-31T07:45:02Z	A Flexible Geometric Mean Decomposition Processor for MIMO Communication Systems	CHIA-HSIANG YANG;C.-H. Yang;C.-E. Chen;Y.-C. Tsai; Y.-C. Tsai; C.-E. Chen; C.-H. Yang; CHIA-HSIANG YANG

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