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Institution Date Title Author
元智大學 2021/12/21 3D Electromagnetic Simulation and VNA Measurements of Signal Transmission Loss of Cu Interconnects at 1–100 GHz: Surface Finish Effect C. J. Yu; H. W. Tseng; S. Kao; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學 2021/11/13 Effect of Etch Factor on the Signal Transmission Performance of Cu Interconnects S. C. Chang; C. J. Yu; Y. C. Chiang; C. H. Chou; Chien-Chang Huang; Cheng-En Ho
元智大學 2021/11/13 Effect of Etch Factor on the Signal Transmission Performance of Cu Interconnects S. C. Chang; C. J. Yu; Y. C. Chiang; C. H. Chou; Chien-Chang Huang; Cheng-En Ho
元智大學 2020/10/21 Electromagnetic Properties of Ni(P) and Its Signal Transmission Performance in 5G Communication Applications W. L. Chou; H. W. Tseng; C. J. Yu; C. Y. Lee; Huei-Ru Fuh; T. T. Kuo; Chien-Chang Huang; Cheng-En Ho
元智大學 2020/10/21 Electromagnetic Properties of Ni(P) and Its Signal Transmission Performance in 5G Communication Applications W. L. Chou; H. W. Tseng; C. J. Yu; C. Y. Lee; Huei-Ru Fuh; T. T. Kuo; Chien-Chang Huang; Cheng-En Ho
元智大學 2019/10/23 Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission Cheng-En Ho; Chien-Chang Huang; Y. S. Wu; W. L. Chou; C. J. Yu; C. Y. Lee; C. S. Chen
元智大學 2019/10/23 Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission Cheng-En Ho; Chien-Chang Huang; Y. S. Wu; W. L. Chou; C. J. Yu; C. Y. Lee; C. S. Chen
元智大學 2019/10/23 Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission Y. S. Wu; C. J. Yu; W. L. Chou; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
元智大學 2019/10/23 Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission Y. S. Wu; C. J. Yu; W. L. Chou; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
臺大學術典藏 2018-09-10T07:43:20Z Heuristic algorithm for the resource-constrained scheduling problem during high-level synthesis Y.-H. Wu;C.-J. Yu;S.-D. Wang; Y.-H. Wu; C.-J. Yu; S.-D. Wang; SHENG-DE WANG

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