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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
研討會
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Institution Date Title Author
義守大學 2016-04 High-Speed Camera Investigation into Fracture Behavior of Solder Ball Joints Under Dynamic Loading D.-S. Liu;C.-L. Hsu;C.-L. Chung
義守大學 2009-06 Comparison between die attach film (DAF) and film over wire (FOW) on stack-die CSP application C.L. Chung;C.W. Ku;H.C. Hsu;S. L. Fu
義守大學 2008-10 Characteristic of the Wire-Penetration Films for Stack-Die CSP Application C.L. Chung;H.C. Hsu;S. L. Fu
國立中山大學 2005-02 An implantable bi-directional wireless transmission system for transcutaneous biological signal recording C.K. Liang;J.J. Chen; C.L. Chung; C.L. Cheng ; C.C. Wang
國立中山大學 2005 An implantable bi-directional wireless transmission system for transcutaneous biological signal recording C.K. Liang;J.J.J. Chen;C.L. Chung;C.L. Cheng;C.C. Wang
南台科技大學 2004 Development of Bi-directional Wireless Communication Biomicrosystem for In-vivo Measurement of Impedance of Cuff Electrode Y. T. Li; Jia-Jin J. Chen; 梁治國; Chih-Kuo Liang; C. L. Chung; C. H. Chang
義守大學 2002-12 Study on Failure Mechanism of PCT Reliability for BT Substrate Based CSP(Chip Scale Package) C. L. Chung;James Fan, M. L. Huang; F. J. Tsai
義守大學 2002-12 Study on failure mechanism of PCT reliability for BT substrate based CSP (chip scale package) C. L. Chung;James Fan;M. L. Huang;F. J. Tsai
義守大學 2002-12 Environmental friendly CSP C.L. Chung;Penny Kao;S. L. Fu;Steven Chou;Alex Lu;R.B. Tsai;Y.J. lee;M.L.Huang;Peter Ku
義守大學 2002-11 Influences of material source, wafer process and location on silicon die fracture strength D. S. Liu;Y. S. Shih;C. Y. Ni;D. Y. Chiou;C. L. Chung;M. L. Huang
國立中山大學 2002 Interfacial Microstructure of Pb-Free and Pb-Sn Solder Balls in the Ball-Grid Array Package Chin-Su Chi;Hen-So Chang;Ker-Chang Hsieh;C.L. Chung
國立中山大學 1995 Phase Behavior of Poly(p-oxybenzoate-co-ethylene terephthalate): Existence of Two ET-rich Phases C.L. Chung;A.C. Su;C.F. Chu

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