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Showing items 21-28 of 28  (2 Page(s) Totally)
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Institution Date Title Author
國立中山大學 2001-11 Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard thin shrink small outline packages T.S. Horng; S.M. Wu;C.T. Chiu; C.P. Hung
國立中山大學 2001-09 Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs T.S. Horng; S.M. Wu; H.H. Hwang;C.T. Chiu; C.P. Hung
國立中山大學 2001-05 Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs T.S. Horng;S.M. Wu;H.H. Huang;C.T. Chiu;C.P. Hung
國立中山大學 2001-05 Modeling and evaluating leadframe CSPs for RFICs in wireless applications T.S. Horng;S.M. Wu;H.H. Huang;C.T. Chiu;C.P. Hung
國立中山大學 2001 Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs T.S. Horng;S.M. Wu;H.H. Hwang;C.T. Chiu;C.P. Hung
國立中山大學 2001 Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard thin shrink small outline packages T.S. Horng;S.M. Wu;C.T. Chiu;C.P. Hung
國立中山大學 2000-05 Electrical performance on RFICs using bump chip carrier packages as compared to standard small outline packages T.S. Horng;S.M. Wu;J.Y. Li;C.T. Chiu;C.P. Hung
中原大學 1996 A Study of Scheduling Algorithms for Different Criteria Under Different Time Constraints J. C. Chen;L. H. Chang;C. K. Yang;T. S. Long;C. P. Hung

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