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Institution Date Title Author
國立中山大學 2001 Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard thin shrink small outline packages T.S. Horng;S.M. Wu;C.T. Chiu;C.P. Hung
國立中山大學 2000-05 Electrical performance on RFICs using bump chip carrier packages as compared to standard small outline packages T.S. Horng;S.M. Wu;J.Y. Li;C.T. Chiu;C.P. Hung
中原大學 1996 A Study of Scheduling Algorithms for Different Criteria Under Different Time Constraints J. C. Chen;L. H. Chang;C. K. Yang;T. S. Long;C. P. Hung

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