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Institution Date Title Author
義守大學 2005-07 Influence of flux on wetting behavior of lead-free solder balls during the infrared-reflow process Cho-Liang Chung;Kyoung-Sik Moon;C. P. Wong
義守大學 2005 Processing and shape effects on silver paste electrically conductive adhesives (ECAs) Huann-Wu Chiang;Cho-Liang Chung;Liu-Chin Chen;Yi Li;C. P. Wong;Shen-Li Fu

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