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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
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Institution Date Title Author
元智大學 Jun-22 Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Shao-Chin Tseng; Mau-Tsu Tang; Ching-Yu Chiang; C.R. Kao; Cheng-En Ho
元智大學 Jul-21 Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5 P. T. Lee; W. Z. Hsieh; C. Y. Lee; Y. H. Huang; C. Y. Chiang; C. S. Ku; C. R. Kao; Cheng-En Ho
元智大學 2021/5/12 White X-ray Nanodiffraction Study of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 P. T. Lee; W. Z. Hsieh; C. Y. Lee; C. R. Kao; Cheng-En Ho
元智大學 2013-03 Interfacial Reactions and Electromigration in Flip-Chip Solder Joints Cheng-En Ho; C. R. Kao; K. N. Tu
元智大學 2011-09 Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints C. S. Liu; Cheng-En Ho; C. S. Peng; C. R. Kao
國立中山大學 2009 Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates C.C. Chang;Y.W. Lin;Y.S. Lai;C.R. Kao
國立中山大學 2009 Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints Y.S. Lai;C.R. Kao;H.C. Chang;C.L. Kao
國立中山大學 2009 The study of flip chip electromigration under extra high current density Y.W. Lin;J.H. Ke;C.R. Kao;Y.S. Lai
臺北醫學大學 2002 Repeated Ovarian Superovulations Induce Mitochondrial DNA Mutations and Oxidative Damages in Mouse Ovaries. 高淑慧; Lee; S.Y.Liao; T.L.Hsu; T.Y.Chen; Y.F; Tzeng; C.R.Kao; S.H.
國立臺灣大學 2000-10 Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate C. Chen, C. E. Ho, A. H. Lin, G. L. Luo,; C. R. Kao

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