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Institution	Date	Title	Author
臺大學術典藏	2019-11-27T02:02:48Z	Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn	C. ROBERT KAO;Kao C.R.;Lin C.-C.;Chang C.-C.; Chang C.-C.; Lin C.-C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:48Z	Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints	C. ROBERT KAO;Kao C.R.;Lin Y.-L.;Tsai M.-Y.; Tsai M.-Y.; Lin Y.-L.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:45Z	Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering	C. ROBERT KAO;Kao C.R.;Chang C.-C.; Chang C.-C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:41Z	Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature control	C. ROBERT KAO;Kao C.R.;Yang T.L.; Yang T.L.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:41Z	Oxidation behavior of ENIG and ENEPIG surface finish	C. ROBERT KAO;Kao C.R.;Chung C.K.;Chuang H.Y.;Lee C.C.; Lee C.C.; Chuang H.Y.; Chung C.K.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:40Z	Temperature effects on electromigration behavior of solder joints	C. ROBERT KAO;Kao C.R.;Ke J.-H.; Ke J.-H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:40Z	Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volume	C. ROBERT KAO;Kao C.R.;Chang C.C.; Chang C.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:40Z	Spectacular epitaxial growth of (Cu,Ni)6Sn5 formed on Ni substrate	C. ROBERT KAO;Kao C.R.;Chen W.M.; Chen W.M.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:39Z	Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging	C. ROBERT KAO;Kao C.R.;Lai Y.S.;Shih W.L.;Chen W.M.;Chuang H.Y.; Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:39Z	Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding	C. ROBERT KAO;Kao C.R.;Lai Y.S.;Appelt B.K.;Wang Y.W.;Lu Y.H.; Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:36Z	Soldering reactions under space confinement for 3D IC applications	C. ROBERT KAO;Li C.C.;Yu J.J.;Chen Y.J.;Kuo M.S.;Yang T.L.;Chen W.M.;Chuang H.Y.;Kao C.R.; Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:35Z	Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium	C. ROBERT KAO;Kao C.R.;Kang S.K.;Chen W.M.; Chen W.M.; Kang S.K.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:34Z	Volume shrinkage induced by interfacial reactions in micro joints	Zhu Z.X.; Chen M.H.; Kao C.R.; C. ROBERT KAO; C. ROBERT KAO;Kao C.R.;Chen M.H.;Zhu Z.X.;Li C.C.; Li C.C.
臺大學術典藏	2019-11-27T02:02:33Z	Au and Pd embrittlement in space-confined soldering reactions for 3D IC applications	C. ROBERT KAO;Kao C.R.;Chen H.T.;Huang K.Y.;Chen Y.J.; Chen Y.J.; Huang K.Y.; Chen H.T.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:33Z	Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications	C. ROBERT KAO;Kao C.R.;Yang S.;Chung C.K.;Yu J.J.; Yu J.J.; Chung C.K.; Yang S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:31Z	Grain refinement of solder materials by minor element addition	Kao C.R.; C. ROBERT KAO; Yang T.L.; C. ROBERT KAO;Kao C.R.;Yang T.L.;Yu J.J.;Chung C.K.; Chung C.K.; Yu J.J.
臺大學術典藏	2019-11-27T02:02:30Z	Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer	C. ROBERT KAO;Kao C.R.;Hsieh H.H.;Yang S.;Huang K.Y.;Yang T.L.; Yang T.L.; Huang K.Y.; Yang S.; Hsieh H.H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:30Z	Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications	C. ROBERT KAO;Kao C.R.;Yu J.J.;Shih W.L.;Yang T.L.; Yang T.L.; Shih W.L.; Yu J.J.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:29Z	In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints	C. ROBERT KAO;Kao C.R.;Yu L.J.;Wu J.Y.;Yu J.J.; Yu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:28Z	Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinement	C. ROBERT KAO;Kao C.R.;Yang S.;Wu J.Y.;Yu J.J.; Yu J.J.; Wu J.Y.; Yang S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:26Z	Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique	C. ROBERT KAO;Snyder G.J.;Kao C.R.;Ke J.H.;Yang H.W.;Zhu Z.X.;Liu C.K.;Dai M.J.;Liao L.L.;Lee C.C.;Hsu S.J.;Li C.C.; Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:24Z	Morphological evolution induced by volume shrinkage in micro joints	Kao C.R.; C. ROBERT KAO; Yang H.W.; C. ROBERT KAO;Kao C.R.;Yang H.W.
臺大學術典藏	2019-11-27T02:02:24Z	Bonding of copper pillars using electroless Ni plating	C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:23Z	Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni plating	C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:23Z	Study of Sintered Nano-Silver Die Attachment Materials Doped with Indium	C. ROBERT KAO; Kao C.R.; Yang C.A.; C. ROBERT KAO;Kao C.R.;Yang C.A.

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