臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
臺大學術典藏	2019-11-27T02:02:18Z	Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation	C. ROBERT KAO;Shigetou A.;Kao C.R.;Yang T.H.; Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:18Z	Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation	C. ROBERT KAO;Kao C.R.;Liao Y.C.;Wu J.Y.;Chiang P.J.; Chiang P.J.; Wu J.Y.; Liao Y.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:17Z	Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid Interdiffusion	C. ROBERT KAO;Kao C.R.;Chiu Y.S.; Chiu Y.S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:17Z	Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process	C. ROBERT KAO;Kao C.R.;Nishikawa H.;Hung H.-T.;Yang S.; Yang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:17Z	High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications	C. ROBERT KAO;Lee C.C.;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:16Z	Refine microstructure of solder materials via minor element additions	C. ROBERT KAO;Kao C.R.;Yang T.L.;Yu J.J.;Chung C.K.; Chung C.K.; Yu J.J.; Yang T.L.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:16Z	Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars	C. ROBERT KAO;Kao C.R.;Chiu Y.S.;Yang T.H.;Yu H.Y.; Yu H.Y.; Yang T.H.; Chiu Y.S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:15Z	Effect of Ag concentration on small solder volume Ni/SnAg/Ni system	C. ROBERT KAO;Kao C.R.;Chung C.K.;Yang S.;Yu J.J.; Yu J.J.; Yang S.; Chung C.K.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:13Z	Bonding of Copper Pillars Using Electroless Cu Plating	C. ROBERT KAO;Kao C.R.;Chen Y.H.;Hung H.T.;Kao L.Y.; Kao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:13Z	A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics : Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation Process	C. ROBERT KAO;Kao C.R.;Shigetou A.;Yang C.Y.;Yang T.H.; Yang T.H.; Yang C.Y.; Shigetou A.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:12Z	A single bonding process for diverse organic-inorganic integration in IoT devices	C. ROBERT KAO;Kao C.R.;Shigetou A.;Yu H.-Y.;Chiu Y.-S.;Yang T.H.; Yang T.H.; Chiu Y.-S.; Yu H.-Y.; Shigetou A.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:12Z	Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections	C. ROBERT KAO;Kao C.R.;Chen Y.-H.;Weng I.-A.;Yang S.;Hung H.-T.; Hung H.-T.; Yang S.; Weng I.-A.; Chen Y.-H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:11Z	Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications	C. ROBERT KAO;Yang J.-M.;Kao C.R.;Wu J.-Y.; Wu J.-Y.; Kao C.R.; Yang J.-M.; C. ROBERT KAO
元智大學	2018-11-16	Characterization of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 Using Synchrotron White X-ray Laue Diffraction	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Ching-Shun Ku; C. Robert Kao; Cheng-En Ho

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