臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	造訪人次 : 53522565 線上人數 : 847 教育部委託研究計畫計畫執行:國立臺灣大學圖書館

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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機構	日期	題名	作者
臺大學術典藏	2022-09-21T23:30:33Z	Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection	YUNG-SHENG LIN; Hung, Yun Ching; Kao, Chin Li; Lai, Chung Hung; Shih, Po Shao; Huang, Jeng Hau; Tarng, David; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:22Z	Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment	Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:22Z	Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications	Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:22Z	Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis	Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:22Z	A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn	Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:21Z	Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis	Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:21Z	White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5	Lee P.-T;Hsieh W.-Z;Lee C.-Y;Kao C.R;Ho C.-E.; Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:21Z	A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn	Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:21Z	Numerical analysis of an electroless plating problem in gas–liquid two-phase flow	Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:21Z	Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications	Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO

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