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機構	日期	題名	作者
臺大學術典藏	2019-11-27T02:03:07Z	Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish	C. ROBERT KAO;Kao C.R.;Luo W.-C.; Luo W.-C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:03:02Z	Volume effect on the soldering reaction between SnAgCu solders and Ni	C. ROBERT KAO;Kao C.R.;Yang S.C.;Lin Y.W.;Ho C.E.; Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:03:01Z	Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton	C. ROBERT KAO;Tu K.N.;Kao C.R.;Lloyd J.R.;Tamura N.;Wu A.T.; Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:56Z	Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systems	Kao C.R.; C. ROBERT KAO; Yang S.C.; C. ROBERT KAO;Kao C.R.;Yang S.C.
臺大學術典藏	2019-11-27T02:02:56Z	Effect of Zn addition on the interfacial reactions between Cu and lead-free solders	C. ROBERT KAO;Kao C.R.;Chang C.-W.;Ho C.-E.;Yang S.-C.; Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:56Z	Massive spalling of intermetallic compound in lead-free solder joints	C. ROBERT KAO;Kao C.R.;Chang C.-W.;Ho C.-E.;Yang S.-C.; Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:55Z	Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders	C. ROBERT KAO;Kao C.R.;Chang C.C.; Chang C.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:55Z	Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu	C. ROBERT KAO;Kao C.R.;Yang S.C.; Yang S.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:55Z	The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interface	C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:55Z	Tin whisker growth induced by high electron current density	C. ROBERT KAO;Kao C.R.;Lin Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:52Z	Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth	C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:52Z	Microstructure study of high lead bump FCBGA bending test	C. ROBERT KAO;Kao C.R.;Hsiao C.S.;Wang Y.P.;Chang C.C.;Chang P.H.;Hung L.Y.; Hung L.Y.; Chang P.H.; Chang C.C.; Wang Y.P.; Hsiao C.S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:52Z	Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish	C. ROBERT KAO;Lan W.-H.;Kao C.-L.;Lee S.-H.;Chang H.-C.;Kao C.R.;Lail Y.-S.; Lail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:49Z	Development of lead-free solders with superior drop test reliability performance	C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:48Z	Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voids	C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:48Z	Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn	C. ROBERT KAO;Kao C.R.;Lin C.-C.;Chang C.-C.; Chang C.-C.; Lin C.-C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:48Z	Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints	C. ROBERT KAO;Kao C.R.;Lin Y.-L.;Tsai M.-Y.; Tsai M.-Y.; Lin Y.-L.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:45Z	Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering	C. ROBERT KAO;Kao C.R.;Chang C.-C.; Chang C.-C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:41Z	Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature control	C. ROBERT KAO;Kao C.R.;Yang T.L.; Yang T.L.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:41Z	Oxidation behavior of ENIG and ENEPIG surface finish	C. ROBERT KAO;Kao C.R.;Chung C.K.;Chuang H.Y.;Lee C.C.; Lee C.C.; Chuang H.Y.; Chung C.K.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:40Z	Temperature effects on electromigration behavior of solder joints	C. ROBERT KAO;Kao C.R.;Ke J.-H.; Ke J.-H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:40Z	Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volume	C. ROBERT KAO;Kao C.R.;Chang C.C.; Chang C.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:40Z	Spectacular epitaxial growth of (Cu,Ni)6Sn5 formed on Ni substrate	C. ROBERT KAO;Kao C.R.;Chen W.M.; Chen W.M.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:39Z	Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging	C. ROBERT KAO;Kao C.R.;Lai Y.S.;Shih W.L.;Chen W.M.;Chuang H.Y.; Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:39Z	Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding	C. ROBERT KAO;Kao C.R.;Lai Y.S.;Appelt B.K.;Wang Y.W.;Lu Y.H.; Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; Kao C.R.; C. ROBERT KAO

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