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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
臺大學術典藏 2022-09-21T23:30:33Z Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection YUNG-SHENG LIN; Hung, Yun Ching; Kao, Chin Li; Lai, Chung Hung; Shih, Po Shao; Huang, Jeng Hau; Tarng, David; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:22Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:22Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:22Z Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:22Z A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:21Z Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:21Z White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5 Lee P.-T;Hsieh W.-Z;Lee C.-Y;Kao C.R;Ho C.-E.; Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:21Z A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:21Z Numerical analysis of an electroless plating problem in gas–liquid two-phase flow Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:21Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO

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