| 臺大學術典藏 |
2022-09-21T23:30:33Z |
Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection
|
YUNG-SHENG LIN; Hung, Yun Ching; Kao, Chin Li; Lai, Chung Hung; Shih, Po Shao; Huang, Jeng Hau; Tarng, David; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
|
Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis
|
Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
|
Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis
|
Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5
|
Lee P.-T;Hsieh W.-Z;Lee C.-Y;Kao C.R;Ho C.-E.; Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
|
Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
Numerical analysis of an electroless plating problem in gas–liquid two-phase flow
|
Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
|
Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
Numerical analysis of an electroless plating problem in gas–liquid two-phase flow
|
Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5
|
Lee P.-T;Hsieh W.-Z;Lee C.-Y;Kao C.R;Ho C.-E.; Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:24Z |
Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis
|
Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:24Z |
A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
|
Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
|
Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Numerical analysis of an electroless plating problem in gas–liquid two-phase flow
|
Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:22Z |
White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5
|
Lee P.-T;Hsieh W.-Z;Lee C.-Y;Kao C.R;Ho C.-E.; Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-09-21T23:19:32Z |
A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
|
Tsai, Chin Hao; Lin, Sze Yin; Lee, Pei Tzu; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:46Z |
Copper sulfide nano-globules reinforced electrodes for high-performance electrochemical determination of toxic pollutant hydroquinone
|
Maheshwaran S;Balaji R;Chen S.-M;Biswadeep R;Renganathan V;Narendhar C;Kao C.R.; Maheshwaran S; Balaji R; Chen S.-M; Biswadeep R; Renganathan V; Narendhar C; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:46Z |
Artifact-free microstructures of the Cu-In reaction by using cryogenic broad argon beam ion polishing
|
Hung H.T;Lee P.T;Tsai C.H;Kao C.R.; Hung H.T; Lee P.T; Tsai C.H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:45Z |
Highly uniform microfluidic electroless interconnections for chip stacking applications
|
Hung H.T;Ma Z.D;Shih P.S;Huang J.H;Kao L.Y;Yang C.Y;Renganathan V;Kao C.L;Hung Y.C;Kao C.R.; Hung H.T; Ma Z.D; Shih P.S; Huang J.H; Kao L.Y; Yang C.Y; Renganathan V; Kao C.L; Hung Y.C; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:45Z |
Foldable Kirigami Paper Electronics
|
Yang T.H;Hida H;Ichige D;Mizuno J;Robert Kao C;Shintake J.; Yang T.H; Hida H; Ichige D; Mizuno J; Robert Kao C; Shintake J.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:45Z |
Effects of plating conditions on electroless Ni-P plating in the microchannel
|
Yang C.-Y;Hung H.-T;Robert Kao C.; Yang C.-Y; Hung H.-T; Robert Kao C.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:45Z |
Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure
|
Hung H.T;Yang S;Shih P.S;Ma Z.D;Huang J.H;Kao C.R.; Hung H.T; Yang S; Shih P.S; Ma Z.D; Huang J.H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:44Z |
The real demonstration of High-Quality Carbon Nano-Tubes (CNTs) as the electrical connection for the potential application in a vertical 3D integrated technology
|
Lu P.-Y;Li Y.-R;Yen C.-M;Hung H.-T;Kao C.-R;Pu W.-C;Chen C.-C.A;Lee M.-H;Liao M.-H.; Lu P.-Y; Li Y.-R; Yen C.-M; Hung H.-T; Kao C.-R; Pu W.-C; Chen C.-C.A; Lee M.-H; Liao M.-H.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:44Z |
Interconnections of low-temperature solder and metallizations
|
Wang Y;Kao C.R.; Wang Y; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-02-04T02:49:00Z |
The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance
|
Liao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; Liao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO; WEI-JIUN SU; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:12Z |
Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system
|
C. ROBERT KAO;Kao C.R.;Ho C.E.;Huang C.G.;Jain T.A.; Jain T.A.; Huang C.G.; Ho C.E.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:11Z |
Optimizing the wire-bonding parameters for second bonds in ball grid array packages
|
C. ROBERT KAO;Kao C.R.;Chen C.;Ho C.E.; Ho C.E.; Chen C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:09Z |
New failure mode induced by electric current in flip chip solder joint
|
C. ROBERT KAO;Kao C.R.;Tsai J.;Hu Y.C.;Lin Y.H.; Lin Y.H.; Hu Y.C.; Tsai J.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization
|
C. ROBERT KAO;Kao C.R.;Tsai J.Y.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
Electromigration in tin thin film
|
C. ROBERT KAO;Kao C.R.;Wan S.W.;Hu Y.C.; Hu Y.C.; Wan S.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages
|
C. ROBERT KAO;Kao C.R.;Tsai J.;Lin Y.L.; Lin Y.L.; Tsai J.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:07Z |
Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish
|
C. ROBERT KAO;Kao C.R.;Luo W.-C.; Luo W.-C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:02Z |
Volume effect on the soldering reaction between SnAgCu solders and Ni
|
C. ROBERT KAO;Kao C.R.;Yang S.C.;Lin Y.W.;Ho C.E.; Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:01Z |
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
|
C. ROBERT KAO;Tu K.N.;Kao C.R.;Lloyd J.R.;Tamura N.;Wu A.T.; Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:56Z |
Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systems
|
Kao C.R.; C. ROBERT KAO; Yang S.C.; C. ROBERT KAO;Kao C.R.;Yang S.C. |
| 臺大學術典藏 |
2019-11-27T02:02:56Z |
Effect of Zn addition on the interfacial reactions between Cu and lead-free solders
|
C. ROBERT KAO;Kao C.R.;Chang C.-W.;Ho C.-E.;Yang S.-C.; Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:56Z |
Massive spalling of intermetallic compound in lead-free solder joints
|
C. ROBERT KAO;Kao C.R.;Chang C.-W.;Ho C.-E.;Yang S.-C.; Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:55Z |
Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders
|
C. ROBERT KAO;Kao C.R.;Chang C.C.; Chang C.C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:55Z |
Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu
|
C. ROBERT KAO;Kao C.R.;Yang S.C.; Yang S.C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:55Z |
The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interface
|
C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:55Z |
Tin whisker growth induced by high electron current density
|
C. ROBERT KAO;Kao C.R.;Lin Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:52Z |
Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth
|
C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:52Z |
Microstructure study of high lead bump FCBGA bending test
|
C. ROBERT KAO;Kao C.R.;Hsiao C.S.;Wang Y.P.;Chang C.C.;Chang P.H.;Hung L.Y.; Hung L.Y.; Chang P.H.; Chang C.C.; Wang Y.P.; Hsiao C.S.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:52Z |
Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish
|
C. ROBERT KAO;Lan W.-H.;Kao C.-L.;Lee S.-H.;Chang H.-C.;Kao C.R.;Lail Y.-S.; Lail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:49Z |
Development of lead-free solders with superior drop test reliability performance
|
C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:48Z |
Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voids
|
C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO |
