| 臺大學術典藏 |
2021-08-05T02:40:45Z |
Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure
|
Hung H.T;Yang S;Shih P.S;Ma Z.D;Huang J.H;Kao C.R.; Hung H.T; Yang S; Shih P.S; Ma Z.D; Huang J.H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:44Z |
The real demonstration of High-Quality Carbon Nano-Tubes (CNTs) as the electrical connection for the potential application in a vertical 3D integrated technology
|
Lu P.-Y;Li Y.-R;Yen C.-M;Hung H.-T;Kao C.-R;Pu W.-C;Chen C.-C.A;Lee M.-H;Liao M.-H.; Lu P.-Y; Li Y.-R; Yen C.-M; Hung H.-T; Kao C.-R; Pu W.-C; Chen C.-C.A; Lee M.-H; Liao M.-H.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:44Z |
Interconnections of low-temperature solder and metallizations
|
Wang Y;Kao C.R.; Wang Y; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-02-04T02:49:00Z |
The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance
|
Liao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; Liao, M.-H.; Lu, P.-Y.; Su, W.-J.; Chen, S.-C.; Hung, H.-T.; Kao, C.-R.; Pu, W.-C.; Chen, C.-C.A.; Lee, M.-H.; MING-HAN LIAO; WEI-JIUN SU; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:12Z |
Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system
|
C. ROBERT KAO;Kao C.R.;Ho C.E.;Huang C.G.;Jain T.A.; Jain T.A.; Huang C.G.; Ho C.E.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:11Z |
Optimizing the wire-bonding parameters for second bonds in ball grid array packages
|
C. ROBERT KAO;Kao C.R.;Chen C.;Ho C.E.; Ho C.E.; Chen C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:09Z |
New failure mode induced by electric current in flip chip solder joint
|
C. ROBERT KAO;Kao C.R.;Tsai J.;Hu Y.C.;Lin Y.H.; Lin Y.H.; Hu Y.C.; Tsai J.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization
|
C. ROBERT KAO;Kao C.R.;Tsai J.Y.; Tsai J.Y.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
Electromigration in tin thin film
|
C. ROBERT KAO;Kao C.R.;Wan S.W.;Hu Y.C.; Hu Y.C.; Wan S.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:08Z |
Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages
|
C. ROBERT KAO;Kao C.R.;Tsai J.;Lin Y.L.; Lin Y.L.; Tsai J.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:07Z |
Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish
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C. ROBERT KAO;Kao C.R.;Luo W.-C.; Luo W.-C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:02Z |
Volume effect on the soldering reaction between SnAgCu solders and Ni
|
C. ROBERT KAO;Kao C.R.;Yang S.C.;Lin Y.W.;Ho C.E.; Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:03:01Z |
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
|
C. ROBERT KAO;Tu K.N.;Kao C.R.;Lloyd J.R.;Tamura N.;Wu A.T.; Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:56Z |
Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systems
|
Kao C.R.; C. ROBERT KAO; Yang S.C.; C. ROBERT KAO;Kao C.R.;Yang S.C. |
| 臺大學術典藏 |
2019-11-27T02:02:56Z |
Effect of Zn addition on the interfacial reactions between Cu and lead-free solders
|
C. ROBERT KAO;Kao C.R.;Chang C.-W.;Ho C.-E.;Yang S.-C.; Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:56Z |
Massive spalling of intermetallic compound in lead-free solder joints
|
C. ROBERT KAO;Kao C.R.;Chang C.-W.;Ho C.-E.;Yang S.-C.; Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:55Z |
Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders
|
C. ROBERT KAO;Kao C.R.;Chang C.C.; Chang C.C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:55Z |
Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu
|
C. ROBERT KAO;Kao C.R.;Yang S.C.; Yang S.C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:55Z |
The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interface
|
C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:55Z |
Tin whisker growth induced by high electron current density
|
C. ROBERT KAO;Kao C.R.;Lin Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:52Z |
Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth
|
C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:52Z |
Microstructure study of high lead bump FCBGA bending test
|
C. ROBERT KAO;Kao C.R.;Hsiao C.S.;Wang Y.P.;Chang C.C.;Chang P.H.;Hung L.Y.; Hung L.Y.; Chang P.H.; Chang C.C.; Wang Y.P.; Hsiao C.S.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:52Z |
Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish
|
C. ROBERT KAO;Lan W.-H.;Kao C.-L.;Lee S.-H.;Chang H.-C.;Kao C.R.;Lail Y.-S.; Lail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:49Z |
Development of lead-free solders with superior drop test reliability performance
|
C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:48Z |
Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voids
|
C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:48Z |
Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn
|
C. ROBERT KAO;Kao C.R.;Lin C.-C.;Chang C.-C.; Chang C.-C.; Lin C.-C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:48Z |
Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints
|
C. ROBERT KAO;Kao C.R.;Lin Y.-L.;Tsai M.-Y.; Tsai M.-Y.; Lin Y.-L.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:45Z |
Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering
|
C. ROBERT KAO;Kao C.R.;Chang C.-C.; Chang C.-C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:41Z |
Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature control
|
C. ROBERT KAO;Kao C.R.;Yang T.L.; Yang T.L.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:41Z |
Oxidation behavior of ENIG and ENEPIG surface finish
|
C. ROBERT KAO;Kao C.R.;Chung C.K.;Chuang H.Y.;Lee C.C.; Lee C.C.; Chuang H.Y.; Chung C.K.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:40Z |
Temperature effects on electromigration behavior of solder joints
|
C. ROBERT KAO;Kao C.R.;Ke J.-H.; Ke J.-H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:40Z |
Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volume
|
C. ROBERT KAO;Kao C.R.;Chang C.C.; Chang C.C.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:40Z |
Spectacular epitaxial growth of (Cu,Ni)6Sn5 formed on Ni substrate
|
C. ROBERT KAO;Kao C.R.;Chen W.M.; Chen W.M.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:39Z |
Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging
|
C. ROBERT KAO;Kao C.R.;Lai Y.S.;Shih W.L.;Chen W.M.;Chuang H.Y.; Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:39Z |
Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding
|
C. ROBERT KAO;Kao C.R.;Lai Y.S.;Appelt B.K.;Wang Y.W.;Lu Y.H.; Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:36Z |
Soldering reactions under space confinement for 3D IC applications
|
C. ROBERT KAO;Li C.C.;Yu J.J.;Chen Y.J.;Kuo M.S.;Yang T.L.;Chen W.M.;Chuang H.Y.;Kao C.R.; Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:35Z |
Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
|
C. ROBERT KAO;Kao C.R.;Kang S.K.;Chen W.M.; Chen W.M.; Kang S.K.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:34Z |
Volume shrinkage induced by interfacial reactions in micro joints
|
Zhu Z.X.; Chen M.H.; Kao C.R.; C. ROBERT KAO; C. ROBERT KAO;Kao C.R.;Chen M.H.;Zhu Z.X.;Li C.C.; Li C.C. |
| 臺大學術典藏 |
2019-11-27T02:02:33Z |
Au and Pd embrittlement in space-confined soldering reactions for 3D IC applications
|
C. ROBERT KAO;Kao C.R.;Chen H.T.;Huang K.Y.;Chen Y.J.; Chen Y.J.; Huang K.Y.; Chen H.T.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:33Z |
Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications
|
C. ROBERT KAO;Kao C.R.;Yang S.;Chung C.K.;Yu J.J.; Yu J.J.; Chung C.K.; Yang S.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:31Z |
Grain refinement of solder materials by minor element addition
|
Kao C.R.; C. ROBERT KAO; Yang T.L.; C. ROBERT KAO;Kao C.R.;Yang T.L.;Yu J.J.;Chung C.K.; Chung C.K.; Yu J.J. |
| 臺大學術典藏 |
2019-11-27T02:02:30Z |
Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer
|
C. ROBERT KAO;Kao C.R.;Hsieh H.H.;Yang S.;Huang K.Y.;Yang T.L.; Yang T.L.; Huang K.Y.; Yang S.; Hsieh H.H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:30Z |
Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications
|
C. ROBERT KAO;Kao C.R.;Yu J.J.;Shih W.L.;Yang T.L.; Yang T.L.; Shih W.L.; Yu J.J.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:29Z |
In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints
|
C. ROBERT KAO;Kao C.R.;Yu L.J.;Wu J.Y.;Yu J.J.; Yu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:28Z |
Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinement
|
C. ROBERT KAO;Kao C.R.;Yang S.;Wu J.Y.;Yu J.J.; Yu J.J.; Wu J.Y.; Yang S.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:26Z |
Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique
|
C. ROBERT KAO;Snyder G.J.;Kao C.R.;Ke J.H.;Yang H.W.;Zhu Z.X.;Liu C.K.;Dai M.J.;Liao L.L.;Lee C.C.;Hsu S.J.;Li C.C.; Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:24Z |
Morphological evolution induced by volume shrinkage in micro joints
|
Kao C.R.; C. ROBERT KAO; Yang H.W.; C. ROBERT KAO;Kao C.R.;Yang H.W. |
| 臺大學術典藏 |
2019-11-27T02:02:24Z |
Bonding of copper pillars using electroless Ni plating
|
C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:23Z |
Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni plating
|
C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:23Z |
Study of Sintered Nano-Silver Die Attachment Materials Doped with Indium
|
C. ROBERT KAO; Kao C.R.; Yang C.A.; C. ROBERT KAO;Kao C.R.;Yang C.A. |
