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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
研討會
機構典藏系統RC7版本已
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Showing items 36-45 of 94  (10 Page(s) Totally)
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Institution Date Title Author
臺大學術典藏 2019-11-27T02:03:07Z Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish C. ROBERT KAO;Kao C.R.;Luo W.-C.; Luo W.-C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:03:02Z Volume effect on the soldering reaction between SnAgCu solders and Ni C. ROBERT KAO;Kao C.R.;Yang S.C.;Lin Y.W.;Ho C.E.; Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:03:01Z Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton C. ROBERT KAO;Tu K.N.;Kao C.R.;Lloyd J.R.;Tamura N.;Wu A.T.; Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:56Z Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systems Kao C.R.; C. ROBERT KAO; Yang S.C.; C. ROBERT KAO;Kao C.R.;Yang S.C.
臺大學術典藏 2019-11-27T02:02:56Z Effect of Zn addition on the interfacial reactions between Cu and lead-free solders C. ROBERT KAO;Kao C.R.;Chang C.-W.;Ho C.-E.;Yang S.-C.; Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:56Z Massive spalling of intermetallic compound in lead-free solder joints C. ROBERT KAO;Kao C.R.;Chang C.-W.;Ho C.-E.;Yang S.-C.; Yang S.-C.; Ho C.-E.; Chang C.-W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:55Z Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders C. ROBERT KAO;Kao C.R.;Chang C.C.; Chang C.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:55Z Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu C. ROBERT KAO;Kao C.R.;Yang S.C.; Yang S.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:55Z The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interface C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:55Z Tin whisker growth induced by high electron current density C. ROBERT KAO;Kao C.R.;Lin Y.W.; Lin Y.W.; Kao C.R.; C. ROBERT KAO

Showing items 36-45 of 94  (10 Page(s) Totally)
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