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Showing items 46-55 of 94  (10 Page(s) Totally)
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Institution Date Title Author
臺大學術典藏 2019-11-27T02:02:52Z Minor Fe, Co, and Ni additions to SnAgCu solders for retarding CU3Sn growth C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:52Z Microstructure study of high lead bump FCBGA bending test C. ROBERT KAO;Kao C.R.;Hsiao C.S.;Wang Y.P.;Chang C.C.;Chang P.H.;Hung L.Y.; Hung L.Y.; Chang P.H.; Chang C.C.; Wang Y.P.; Hsiao C.S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:52Z Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish C. ROBERT KAO;Lan W.-H.;Kao C.-L.;Lee S.-H.;Chang H.-C.;Kao C.R.;Lail Y.-S.; Lail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:49Z Development of lead-free solders with superior drop test reliability performance C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:48Z Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voids C. ROBERT KAO;Kao C.R.;Wang Y.W.; Wang Y.W.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:48Z Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn C. ROBERT KAO;Kao C.R.;Lin C.-C.;Chang C.-C.; Chang C.-C.; Lin C.-C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:48Z Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints C. ROBERT KAO;Kao C.R.;Lin Y.-L.;Tsai M.-Y.; Tsai M.-Y.; Lin Y.-L.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:45Z Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering C. ROBERT KAO;Kao C.R.;Chang C.-C.; Chang C.-C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:41Z Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature control C. ROBERT KAO;Kao C.R.;Yang T.L.; Yang T.L.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:41Z Oxidation behavior of ENIG and ENEPIG surface finish C. ROBERT KAO;Kao C.R.;Chung C.K.;Chuang H.Y.;Lee C.C.; Lee C.C.; Chuang H.Y.; Chung C.K.; Kao C.R.; C. ROBERT KAO

Showing items 46-55 of 94  (10 Page(s) Totally)
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