臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Showing items 56-65 of 94 (10 Page(s) Totally)
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Institution	Date	Title	Author
臺大學術典藏	2019-11-27T02:02:40Z	Temperature effects on electromigration behavior of solder joints	C. ROBERT KAO;Kao C.R.;Ke J.-H.; Ke J.-H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:40Z	Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volume	C. ROBERT KAO;Kao C.R.;Chang C.C.; Chang C.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:40Z	Spectacular epitaxial growth of (Cu,Ni)6Sn5 formed on Ni substrate	C. ROBERT KAO;Kao C.R.;Chen W.M.; Chen W.M.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:39Z	Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging	C. ROBERT KAO;Kao C.R.;Lai Y.S.;Shih W.L.;Chen W.M.;Chuang H.Y.; Chuang H.Y.; Chen W.M.; Shih W.L.; Lai Y.S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:39Z	Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding	C. ROBERT KAO;Kao C.R.;Lai Y.S.;Appelt B.K.;Wang Y.W.;Lu Y.H.; Lu Y.H.; Wang Y.W.; Appelt B.K.; Lai Y.S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:36Z	Soldering reactions under space confinement for 3D IC applications	C. ROBERT KAO;Li C.C.;Yu J.J.;Chen Y.J.;Kuo M.S.;Yang T.L.;Chen W.M.;Chuang H.Y.;Kao C.R.; Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:35Z	Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium	C. ROBERT KAO;Kao C.R.;Kang S.K.;Chen W.M.; Chen W.M.; Kang S.K.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:34Z	Volume shrinkage induced by interfacial reactions in micro joints	Zhu Z.X.; Chen M.H.; Kao C.R.; C. ROBERT KAO; C. ROBERT KAO;Kao C.R.;Chen M.H.;Zhu Z.X.;Li C.C.; Li C.C.
臺大學術典藏	2019-11-27T02:02:33Z	Au and Pd embrittlement in space-confined soldering reactions for 3D IC applications	C. ROBERT KAO;Kao C.R.;Chen H.T.;Huang K.Y.;Chen Y.J.; Chen Y.J.; Huang K.Y.; Chen H.T.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:33Z	Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications	C. ROBERT KAO;Kao C.R.;Yang S.;Chung C.K.;Yu J.J.; Yu J.J.; Chung C.K.; Yang S.; Kao C.R.; C. ROBERT KAO

Showing items 56-65 of 94 (10 Page(s) Totally)
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