臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	Repositories
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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	機構典藏計畫網站
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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
臺大學術典藏	2019-11-27T02:02:36Z	Soldering reactions under space confinement for 3D IC applications	C. ROBERT KAO;Li C.C.;Yu J.J.;Chen Y.J.;Kuo M.S.;Yang T.L.;Chen W.M.;Chuang H.Y.;Kao C.R.; Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; Li C.C.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:35Z	Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium	C. ROBERT KAO;Kao C.R.;Kang S.K.;Chen W.M.; Chen W.M.; Kang S.K.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:34Z	Volume shrinkage induced by interfacial reactions in micro joints	Zhu Z.X.; Chen M.H.; Kao C.R.; C. ROBERT KAO; C. ROBERT KAO;Kao C.R.;Chen M.H.;Zhu Z.X.;Li C.C.; Li C.C.
臺大學術典藏	2019-11-27T02:02:33Z	Au and Pd embrittlement in space-confined soldering reactions for 3D IC applications	C. ROBERT KAO;Kao C.R.;Chen H.T.;Huang K.Y.;Chen Y.J.; Chen Y.J.; Huang K.Y.; Chen H.T.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:33Z	Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications	C. ROBERT KAO;Kao C.R.;Yang S.;Chung C.K.;Yu J.J.; Yu J.J.; Chung C.K.; Yang S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:31Z	Grain refinement of solder materials by minor element addition	Kao C.R.; C. ROBERT KAO; Yang T.L.; C. ROBERT KAO;Kao C.R.;Yang T.L.;Yu J.J.;Chung C.K.; Chung C.K.; Yu J.J.
臺大學術典藏	2019-11-27T02:02:30Z	Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer	C. ROBERT KAO;Kao C.R.;Hsieh H.H.;Yang S.;Huang K.Y.;Yang T.L.; Yang T.L.; Huang K.Y.; Yang S.; Hsieh H.H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:30Z	Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications	C. ROBERT KAO;Kao C.R.;Yu J.J.;Shih W.L.;Yang T.L.; Yang T.L.; Shih W.L.; Yu J.J.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:29Z	In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints	C. ROBERT KAO;Kao C.R.;Yu L.J.;Wu J.Y.;Yu J.J.; Yu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:28Z	Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinement	C. ROBERT KAO;Kao C.R.;Yang S.;Wu J.Y.;Yu J.J.; Yu J.J.; Wu J.Y.; Yang S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:26Z	Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique	C. ROBERT KAO;Snyder G.J.;Kao C.R.;Ke J.H.;Yang H.W.;Zhu Z.X.;Liu C.K.;Dai M.J.;Liao L.L.;Lee C.C.;Hsu S.J.;Li C.C.; Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:24Z	Morphological evolution induced by volume shrinkage in micro joints	Kao C.R.; C. ROBERT KAO; Yang H.W.; C. ROBERT KAO;Kao C.R.;Yang H.W.
臺大學術典藏	2019-11-27T02:02:24Z	Bonding of copper pillars using electroless Ni plating	C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:23Z	Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni plating	C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:23Z	Study of Sintered Nano-Silver Die Attachment Materials Doped with Indium	C. ROBERT KAO; Kao C.R.; Yang C.A.; C. ROBERT KAO;Kao C.R.;Yang C.A.
臺大學術典藏	2019-11-27T02:02:23Z	Choice of Intermetallic Compounds for Structural Applications in Near Submicron Joints	C. ROBERT KAO;Kao C.R.;Yu L.J.;Wu J.Y.;Yu J.J.; Yu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:22Z	Contacts for PbTe	C. ROBERT KAO;Kao C.R.;Li C.-C.; Li C.-C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:21Z	Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint	C. ROBERT KAO;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:20Z	Critical Factors Affecting Structural Transformations in 3D IC Micro Joints	C. ROBERT KAO;Kao C.R.;Yu H.Y.;Yang H.W.; Yang H.W.; Yu H.Y.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:19Z	Bonding of copper pillars using electroless Au plating	C. ROBERT KAO;Kao C.R.;Chen Y.H.;Yang S.;Hung H.T.;Weng I.A.; Weng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:18Z	Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation	C. ROBERT KAO;Shigetou A.;Kao C.R.;Yang T.H.; Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:18Z	Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation	C. ROBERT KAO;Kao C.R.;Liao Y.C.;Wu J.Y.;Chiang P.J.; Chiang P.J.; Wu J.Y.; Liao Y.C.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:17Z	Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid Interdiffusion	C. ROBERT KAO;Kao C.R.;Chiu Y.S.; Chiu Y.S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:17Z	Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process	C. ROBERT KAO;Kao C.R.;Nishikawa H.;Hung H.-T.;Yang S.; Yang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:17Z	High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications	C. ROBERT KAO;Lee C.C.;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO

Showing items 61-85 of 94 (4 Page(s) Totally)
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