臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
臺大學術典藏	2019-11-27T02:02:31Z	Grain refinement of solder materials by minor element addition	Kao C.R.; C. ROBERT KAO; Yang T.L.; C. ROBERT KAO;Kao C.R.;Yang T.L.;Yu J.J.;Chung C.K.; Chung C.K.; Yu J.J.
臺大學術典藏	2019-11-27T02:02:30Z	Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer	C. ROBERT KAO;Kao C.R.;Hsieh H.H.;Yang S.;Huang K.Y.;Yang T.L.; Yang T.L.; Huang K.Y.; Yang S.; Hsieh H.H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:30Z	Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications	C. ROBERT KAO;Kao C.R.;Yu J.J.;Shih W.L.;Yang T.L.; Yang T.L.; Shih W.L.; Yu J.J.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:29Z	In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints	C. ROBERT KAO;Kao C.R.;Yu L.J.;Wu J.Y.;Yu J.J.; Yu J.J.; Wu J.Y.; Yu L.J.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:28Z	Effect of Ag concentration on Ni/Sn-xAg/Ni micro joints under space confinement	C. ROBERT KAO;Kao C.R.;Yang S.;Wu J.Y.;Yu J.J.; Yu J.J.; Wu J.Y.; Yang S.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:26Z	Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique	C. ROBERT KAO;Snyder G.J.;Kao C.R.;Ke J.H.;Yang H.W.;Zhu Z.X.;Liu C.K.;Dai M.J.;Liao L.L.;Lee C.C.;Hsu S.J.;Li C.C.; Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:24Z	Morphological evolution induced by volume shrinkage in micro joints	Kao C.R.; C. ROBERT KAO; Yang H.W.; C. ROBERT KAO;Kao C.R.;Yang H.W.
臺大學術典藏	2019-11-27T02:02:24Z	Bonding of copper pillars using electroless Ni plating	C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:23Z	Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni plating	C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:23Z	Study of Sintered Nano-Silver Die Attachment Materials Doped with Indium	C. ROBERT KAO; Kao C.R.; Yang C.A.; C. ROBERT KAO;Kao C.R.;Yang C.A.

Showing items 66-75 of 94 (10 Page(s) Totally)
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