臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	Repositories
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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
臺大學術典藏	2019-11-27T02:02:12Z	A single bonding process for diverse organic-inorganic integration in IoT devices	C. ROBERT KAO;Kao C.R.;Shigetou A.;Yu H.-Y.;Chiu Y.-S.;Yang T.H.; Yang T.H.; Chiu Y.-S.; Yu H.-Y.; Shigetou A.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:12Z	Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections	C. ROBERT KAO;Kao C.R.;Chen Y.-H.;Weng I.-A.;Yang S.;Hung H.-T.; Hung H.-T.; Yang S.; Weng I.-A.; Chen Y.-H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:11Z	Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications	C. ROBERT KAO;Yang J.-M.;Kao C.R.;Wu J.-Y.; Wu J.-Y.; Kao C.R.; Yang J.-M.; C. ROBERT KAO
元智大學	2018-11-16	Characterization of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 Using Synchrotron White X-ray Laue Diffraction	Pei-Tzu Lee; Wan-Zhen Hsieh; Cheng-Yu Lee; Ching-Shun Ku; C. Robert Kao; Cheng-En Ho

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