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Showing items 11-20 of 46  (5 Page(s) Totally)
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Institution Date Title Author
元智大學 2016-04-01 Corporate Social Responsibility and Financial Performance: The Role of Input Ratio Substitution C-S Wang; Ruei-Shian Wu
國立臺灣海洋大學 2013 Identification of popelines from the secondary reflect wave travel time of ground penetrating radar waves Lee;K. F.;T. K. Wang;Y. M. Kang;C. S. Wang;K. A. Lin;; 王天楷
朝陽科技大學 2008-12-31 T-DNA activation tagging as a tool to isolate Salvia miltiorrhiza Bunge transgenic lines for higher yields of pharmacological tanshinones 蔡新聲; Lee, C. Y.; D.C. Agrawal; T.M. Chou; C. S. Wang; S.M. Yu; J.W. Chen and H.S Tsay
元智大學 2008-04 Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components 陳永樹; C.S. Wang; Y.J. Yang
國立中山大學 2008 Propofol pretreatment attenuates LPS-induced granulocyte-macrophage colony-stimulating factor production in cultured hepatocytes by suppressing MAPK/ERK activity and NF-kappaB translocation B. Jawan;Y.H. Kao;S. Goto;M.C. Pan;Y.C. Lin;L.W. Hsu;T. Nakano;C.Y. Lai;C.K. Sun;Y.F. Cheng;M.H. Tai;H.L. Eng;C.S. Wang;C.J. Huang;C.R. Lin;C.L. Chen
國立臺灣海洋大學 2007-01 Optimal Design of a 1-kWe Thermal Plasma Reformer C. S. Wang; Y.C. Chang; S.S. Hong; H.B. Lee; Huan-Liang Tsai; N.S. Kuoa; K. I. Chang; C.H. Kuo
元智大學 2006-07 Influence of the Lead Free Solder Material and Solder Mask Dimensions on the FCBGA Components Reliability 陳永樹; C.S. Wang; T.C. Wang; W.H. Chan; K.C. Chang; T.D. Yuan
元智大學 2006-03 The Experimental Study for the Solder Joint Reliability of High I/O FCBGA’s with Thermal Loaded Bend Test 陳永樹; C.S. Wang; A.C. Shiah
南台科技大學 2005-09 A High efficiency CMOS Image Sensor with Air-Gap-in -Situ-Microlen (AGML) Fabricated by 0.18um CMOS Technology T.H. Hsu; Y.K. Fang; D.N. Yaung; S.G. Wuu; H.C. Chien; C.H. Tseng; L.L. Yao; W.D. Wang; C.S. Wang; S.F. Chen;陳世芳
國立中山大學 2005-08-15 A Numerical Simulation for Heat and Mass Transfer in a Micro-Channel Fuel Cell Reformer R. Yang; J.H. Shou; S.Y. Lin; C.S. Wang

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