臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
臺大學術典藏	2019-03-11T08:02:20Z	The relaxation of stress and reduction of KOZ by the special designed trench structure near the TSV for the application of 3-DICs	C.-X. Hong;C.-H. Chen;G.-H. Liu;M.-Y. Yu;M. H.Liao; M. H.Liao; M.-Y. Yu; G.-H. Liu; C.-H. Chen; C.-X. Hong
臺大學術典藏	2019-03-11T08:02:20Z	The relaxation of stress and reduction of KOZ by the special designed trench structure near the TSV for the application of 3-DICs	C.-X. Hong;C.-H. Chen;G.-H. Liu;M.-Y. Yu;M. H.Liao; M. H.Liao; M.-Y. Yu; G.-H. Liu; C.-H. Chen; C.-X. Hong
臺大學術典藏	2019-03-11T08:02:17Z	The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)	C.-X. Hong;C.-H. Chen;M.-Y. Yu;G.-H. Liu;M. H.Liao; M. H.Liao; G.-H. Liu; M.-Y. Yu; C.-H. Chen; C.-X. Hong
臺大學術典藏	2019-03-11T08:02:17Z	The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)	C.-X. Hong;C.-H. Chen;M.-Y. Yu;G.-H. Liu;M. H.Liao; M. H.Liao; G.-H. Liu; M.-Y. Yu; C.-H. Chen; C.-X. Hong

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