臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
元智大學	Sep-19	Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures	C. H. Yang; Y. W. Lee; C. Y. Lee; C. H. Chang; Cheng-En Ho
元智大學	Nov-23	High-frequency signal transmission in a coplanar waveguide structure with different surface finishes	Y. C. Chiang; H. W. Tseng; C. J. Yu; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學	May-23	Electromigration-induced Remarkable Intermetallic Compound (IMC) Formation in Micro Joints and Its Prevention	P. T. Lee; C. Y. Lee; W. Z. Hsieh; C. T. Chen; Cheng-En Ho
元智大學	May-20	Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations	Cheng-En Ho; C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee
元智大學	May-20	Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations	C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee; Cheng-En Ho
元智大學	May-19	Effect of pulse-reverse plating on copper: thermal mechanical properties and microstructure relationship	B. C. Huang; C. H. Yang; C. Y. Lee; Y. L. Hu; C. C. Hsu; Cheng-En Ho
元智大學	Mar-21	IMC microstructure modification and mechanical reinforcement of Sn-Ag-Cu/Cu microelectronic joints through an advanced surface finish technique	Cheng-En Ho; S. P. Yang; P. T. Lee; C. Y. Lee; C. C. Chen; T. T. Kuo
元智大學	Mar-20	Significantly Improving the Etching Characteristics of Electroplated Cu Films through Microstructure Modification	C. Y. Lee; P. C. Lin; C. H. Yang; Cheng-En Ho
元智大學	Jun-19	Nanoindentation Study of Single-Crystalline and (101)-Oriented Nanotwinned Cu	C. H. Yang; C. Y. Lee; B. C. Huang; P. C. Lin; Cheng-En Ho
元智大學	Jul-21	Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5	P. T. Lee; W. Z. Hsieh; C. Y. Lee; Y. H. Huang; C. Y. Chiang; C. S. Ku; C. R. Kao; Cheng-En Ho
元智大學	Aug-20	Influence of Pd(P) Thickness on the Pd-free Solder Reaction between Eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu Multilayer	C. Y. Lee; S. P. Yang; C. H. Yang; M. K. Lu; T. T. Kuo; Cheng-En Ho
元智大學	Apr-19	In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage	C. H. Yang; S. P. Yang; B. C. Huang; C. Y. Lee; H. C. Liu; Cheng-En Ho
元智大學	2023/10/25	Electromigration Reliability of Micro Joints with Different Surface Finishes	Z. Y. Yang; S. C. Chang; C. T. Chen; W. Z. Hsieh; C. Y. Lee; H. C. Liu; K. H. Lan; P. C. Lin; Cheng-En Ho
元智大學	2023/10/25	Improving Uniformity of Electroplated Cu for TGV Metallization	Y. M. Lin; P. Y. Yeh; C. Y. Lee; K. H. Lin; C. C. Wang; Cheng-En Ho
元智大學	2022-11-18	Electromigration-induced Abnormal Phase Transformation and Massive IMC Propagation in Micro Joints	C. Y. Lee; Y. C. Chiang; C. T. Chen; Cheng-En Ho
元智大學	2022-10-26	Electromigration Reliability of Micro Joints with Au/Pd(P)/Ni(P)/Cu Pads	C. Y. Lee; S. C. Chang; C. T. Chen; H. C. Liu; K. H. Lan; P C. Lin; Cheng-En Ho
元智大學	2021/5/12	White X-ray Nanodiffraction Study of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5	P. T. Lee; W. Z. Hsieh; C. Y. Lee; C. R. Kao; Cheng-En Ho
元智大學	2021/12/21	Microstructure Modification of Copper Interconnects and Their Transmission Losses at 1–40 GHz	C. Y. Lee; S. Kao; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/12/21	Crystal Coherency between Electroplated Cu Fillings and Substrate in A Stacked-via Structure	Y. M. Lin; H. C. Liu; C. Y. Lee; C. S. Hsieh; K. H. Lan; P. C. Lin; Cheng-En Ho
元智大學	2021/12/21	Microstructure Modification of Copper Interconnects and Their Transmission Losses at 1–40 GHz	C. Y. Lee; S. Kao; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/12/21	3D Electromagnetic Simulation and VNA Measurements of Signal Transmission Loss of Cu Interconnects at 1–100 GHz: Surface Finish Effect	C. J. Yu; H. W. Tseng; S. Kao; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/12/21	3D Electromagnetic Simulation and VNA Measurements of Signal Transmission Loss of Cu Interconnects at 1–100 GHz: Surface Finish Effect	C. J. Yu; H. W. Tseng; S. Kao; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Electromagnetic Simulation and VNA Measurements of Surface Finish Effect on the Cu Interconnect Transmission Characteristics at 1–100 GHz	J. C. Yu; H. W. Tseng; C. Y. Lee; P. C. Hsu; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Improvement of High-frequency Transmission Performance through Copper Microstructure Modification	C. Y. Lee; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Electromagnetic Simulation and VNA Measurements of Surface Finish Effect on the Cu Interconnect Transmission Characteristics at 1–100 GHz	J. C. Yu; H. W. Tseng; C. Y. Lee; P. C. Hsu; Chien-Chang Huang; Cheng-En Ho

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