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Showing items 1-10 of 137  (14 Page(s) Totally)
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Institution Date Title Author
元智大學 Sep-19 Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures C. H. Yang; Y. W. Lee; C. Y. Lee; C. H. Chang; Cheng-En Ho
元智大學 Nov-23 High-frequency signal transmission in a coplanar waveguide structure with different surface finishes Y. C. Chiang; H. W. Tseng; C. J. Yu; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學 May-23 Electromigration-induced Remarkable Intermetallic Compound (IMC) Formation in Micro Joints and Its Prevention P. T. Lee; C. Y. Lee; W. Z. Hsieh; C. T. Chen; Cheng-En Ho
元智大學 May-20 Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations Cheng-En Ho; C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee
元智大學 May-20 Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee; Cheng-En Ho
元智大學 May-19 Effect of pulse-reverse plating on copper: thermal mechanical properties and microstructure relationship B. C. Huang; C. H. Yang; C. Y. Lee; Y. L. Hu; C. C. Hsu; Cheng-En Ho
元智大學 Mar-21 IMC microstructure modification and mechanical reinforcement of Sn-Ag-Cu/Cu microelectronic joints through an advanced surface finish technique Cheng-En Ho; S. P. Yang; P. T. Lee; C. Y. Lee; C. C. Chen; T. T. Kuo
元智大學 Mar-20 Significantly Improving the Etching Characteristics of Electroplated Cu Films through Microstructure Modification C. Y. Lee; P. C. Lin; C. H. Yang; Cheng-En Ho
元智大學 Jun-19 Nanoindentation Study of Single-Crystalline and (101)-Oriented Nanotwinned Cu C. H. Yang; C. Y. Lee; B. C. Huang; P. C. Lin; Cheng-En Ho
元智大學 Jul-21 Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5 P. T. Lee; W. Z. Hsieh; C. Y. Lee; Y. H. Huang; C. Y. Chiang; C. S. Ku; C. R. Kao; Cheng-En Ho

Showing items 1-10 of 137  (14 Page(s) Totally)
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