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Institution	Date	Title	Author
元智大學	Sep-19	Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures	C. H. Yang; Y. W. Lee; C. Y. Lee; C. H. Chang; Cheng-En Ho
元智大學	Nov-23	High-frequency signal transmission in a coplanar waveguide structure with different surface finishes	Y. C. Chiang; H. W. Tseng; C. J. Yu; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學	May-23	Electromigration-induced Remarkable Intermetallic Compound (IMC) Formation in Micro Joints and Its Prevention	P. T. Lee; C. Y. Lee; W. Z. Hsieh; C. T. Chen; Cheng-En Ho
元智大學	May-20	Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations	Cheng-En Ho; C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee
元智大學	May-20	Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations	C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee; Cheng-En Ho
元智大學	May-19	Effect of pulse-reverse plating on copper: thermal mechanical properties and microstructure relationship	B. C. Huang; C. H. Yang; C. Y. Lee; Y. L. Hu; C. C. Hsu; Cheng-En Ho
元智大學	Mar-21	IMC microstructure modification and mechanical reinforcement of Sn-Ag-Cu/Cu microelectronic joints through an advanced surface finish technique	Cheng-En Ho; S. P. Yang; P. T. Lee; C. Y. Lee; C. C. Chen; T. T. Kuo
元智大學	Mar-20	Significantly Improving the Etching Characteristics of Electroplated Cu Films through Microstructure Modification	C. Y. Lee; P. C. Lin; C. H. Yang; Cheng-En Ho
元智大學	Jun-19	Nanoindentation Study of Single-Crystalline and (101)-Oriented Nanotwinned Cu	C. H. Yang; C. Y. Lee; B. C. Huang; P. C. Lin; Cheng-En Ho
元智大學	Jul-21	Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5	P. T. Lee; W. Z. Hsieh; C. Y. Lee; Y. H. Huang; C. Y. Chiang; C. S. Ku; C. R. Kao; Cheng-En Ho
元智大學	Aug-20	Influence of Pd(P) Thickness on the Pd-free Solder Reaction between Eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu Multilayer	C. Y. Lee; S. P. Yang; C. H. Yang; M. K. Lu; T. T. Kuo; Cheng-En Ho
元智大學	Apr-19	In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage	C. H. Yang; S. P. Yang; B. C. Huang; C. Y. Lee; H. C. Liu; Cheng-En Ho
元智大學	2023/10/25	Electromigration Reliability of Micro Joints with Different Surface Finishes	Z. Y. Yang; S. C. Chang; C. T. Chen; W. Z. Hsieh; C. Y. Lee; H. C. Liu; K. H. Lan; P. C. Lin; Cheng-En Ho
元智大學	2023/10/25	Improving Uniformity of Electroplated Cu for TGV Metallization	Y. M. Lin; P. Y. Yeh; C. Y. Lee; K. H. Lin; C. C. Wang; Cheng-En Ho
元智大學	2022-11-18	Electromigration-induced Abnormal Phase Transformation and Massive IMC Propagation in Micro Joints	C. Y. Lee; Y. C. Chiang; C. T. Chen; Cheng-En Ho
元智大學	2022-10-26	Electromigration Reliability of Micro Joints with Au/Pd(P)/Ni(P)/Cu Pads	C. Y. Lee; S. C. Chang; C. T. Chen; H. C. Liu; K. H. Lan; P C. Lin; Cheng-En Ho
元智大學	2021/5/12	White X-ray Nanodiffraction Study of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5	P. T. Lee; W. Z. Hsieh; C. Y. Lee; C. R. Kao; Cheng-En Ho
元智大學	2021/12/21	Microstructure Modification of Copper Interconnects and Their Transmission Losses at 1–40 GHz	C. Y. Lee; S. Kao; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/12/21	Crystal Coherency between Electroplated Cu Fillings and Substrate in A Stacked-via Structure	Y. M. Lin; H. C. Liu; C. Y. Lee; C. S. Hsieh; K. H. Lan; P. C. Lin; Cheng-En Ho
元智大學	2021/12/21	Microstructure Modification of Copper Interconnects and Their Transmission Losses at 1–40 GHz	C. Y. Lee; S. Kao; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/12/21	3D Electromagnetic Simulation and VNA Measurements of Signal Transmission Loss of Cu Interconnects at 1–100 GHz: Surface Finish Effect	C. J. Yu; H. W. Tseng; S. Kao; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/12/21	3D Electromagnetic Simulation and VNA Measurements of Signal Transmission Loss of Cu Interconnects at 1–100 GHz: Surface Finish Effect	C. J. Yu; H. W. Tseng; S. Kao; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Electromagnetic Simulation and VNA Measurements of Surface Finish Effect on the Cu Interconnect Transmission Characteristics at 1–100 GHz	J. C. Yu; H. W. Tseng; C. Y. Lee; P. C. Hsu; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Improvement of High-frequency Transmission Performance through Copper Microstructure Modification	C. Y. Lee; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Electromagnetic Simulation and VNA Measurements of Surface Finish Effect on the Cu Interconnect Transmission Characteristics at 1–100 GHz	J. C. Yu; H. W. Tseng; C. Y. Lee; P. C. Hsu; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	COMSOL-Multiphysics Simulation of Current Density and Electrolyte Distributions in Cu Pillar Fabrication	P. T. Lee; C. H. Chang; C. Y. Lee; Y. L. Chen; Cheng-En Ho
元智大學	2021/11/13	Improvement of High-frequency Transmission Performance through Copper Microstructure Modification	C. Y. Lee; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2020/11/7	Thermal Stability and Electrochemical Corrosion of ENEPIG Surface Finish Deposited on the Cu Traces	C. Y. Lee; W. Z. Hsieh; P. T. Lee ; C. H. Li; S. P. Yang; Cheng-En Ho
元智大學	2020/11/7	Microstructure Modification of Copper Interconnects and Its Elongation at Break	C. Y. Lee; C. P. Pan; Y. M. Lin; Y. C. Chiang; Cheng-En Ho
元智大學	2020/11/7	Morphological Transition of Cu6Sn5 and Cu3Sn Induced by Surface Finish and Its Mechanical Reliability of Solder Joints	C. H. Li; C. Y. Lee; S. P. Yang; C. C. Chen; T. T. Kuo; Cheng-En Ho
元智大學	2020/10/21	Microstructure Modification of Fine Copper Lines and Mechanical Reliability	C. Y. Lee; C. P. Pan; P. T. Lee; Y. C. Chiang; H. C. Liu; P. C. Lin; Cheng-En Ho
元智大學	2020/10/21	Electromagnetic Properties of Ni(P) and Its Signal Transmission Performance in 5G Communication Applications	W. L. Chou; H. W. Tseng; C. J. Yu; C. Y. Lee; Huei-Ru Fuh; T. T. Kuo; Chien-Chang Huang; Cheng-En Ho
元智大學	2020/10/21	Effects of Surface Finish on the Intermetallic Compound Formation and Mechanical Reliability of Microelectronic Solder Joints	C. H. Li; S. P. Yang; C. Y. Lee; C. C. Chen; T. T. Kuo; Cheng-En Ho
元智大學	2020/10/21	Electromagnetic Properties of Ni(P) and Its Signal Transmission Performance in 5G Communication Applications	W. L. Chou; H. W. Tseng; C. J. Yu; C. Y. Lee; Huei-Ru Fuh; T. T. Kuo; Chien-Chang Huang; Cheng-En Ho
臺大學術典藏	2020-08-18T06:57:19Z	Tropical Cyclone - Ocean interaction in Typhoon Fanapi (2010) - A synergy study based on ITOP observations, EnKF data assimilation, and coupled atmosphere-ocean models	Sung, S.-L.; C.-C. Wu; I. I. Lin; S.-S. Chen; C.-Y. Lee; Sung, S.-L.; C.-C. Wu; I. I. Lin; S.-S. Chen; C.-Y. Lee; CHUN-CHIEH WU
元智大學	2019/11/15	White X-ray Laue Diffraction Characterization of Microstructure Transition and Stress Relaxation of Electroplating Cu upon Self-annealing	Y. H. Huang; W. Z. Hsieh; C. Y. Lee; C. H. Yang; S. J. Chiu; C. S. Ku; Cheng-En Ho
元智大學	2019/11/15	Nano-XRF and X-ray Nanodiffraction Studies on the Working Mechanism of Flexible Ni(P) Thin Films	W. L. Chou; C. Y. Lee; P. T. Lee; W. Z. Hsieh; C. S. Ku; X. Y. Li; S. C. Tseng; M. T. Tang; Cheng-En Ho
元智大學	2019/11/15	Microstructure Modification of Electroplating Cu and Improvement of Its Etching Characteristics in MEC Roughening Treatment	P. C. Lin; C. Y. Lee; C. H. Chang; H. C. Liu; Cheng-En Ho
元智大學	2019/11/15	Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz	W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/11/15	White X-ray Laue Diffraction Characterization of Microstructure Transition and Stress Relaxation of Electroplating Cu upon Self-annealing	Y. H. Huang; W. Z. Hsieh; C. Y. Lee; C. H. Yang; S. J. Chiu; C. S. Ku; Cheng-En Ho
元智大學	2019/11/15	Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz	W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/11/15	Nano-XRF and X-ray Nanodiffraction Studies on the Working Mechanism of Flexible Ni(P) Thin Films	W. L. Chou; C. Y. Lee; P. T. Lee; W. Z. Hsieh; C. S. Ku; X. Y. Li; S. C. Tseng; M. T. Tang; Cheng-En Ho
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Cheng-En Ho; Chien-Chang Huang; Y. S. Wu; W. L. Chou; C. J. Yu; C. Y. Lee; C. S. Chen
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Cheng-En Ho; Chien-Chang Huang; Y. S. Wu; W. L. Chou; C. J. Yu; C. Y. Lee; C. S. Chen
元智大學	2019/10/23	Roughness Effect of Cu Interconnects on Signal Transmission Performance in 5G Communication Applications	W. L. Chou; Y. S. Wu; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/10/23	Roughness Effect of Cu Interconnects on Signal Transmission Performance in 5G Communication Applications	W. L. Chou; Y. S. Wu; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Y. S. Wu; C. J. Yu; W. L. Chou; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/10/23	Microstructure Modification of Electroplating Cu and Improvement of Its Etching Characteristics in the Roughening Process	C. Y. Lee; P. C. Lin; C. H. Yang; H. C. Liu; K. H. Lan; Cheng-En Ho
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Y. S. Wu; C. J. Yu; W. L. Chou; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
臺大學術典藏	2019-11-29T02:56:40Z	Isotopic perspectives of dietary patterns in Taiwan after the introduction of crops	C. Y. Lee; M. L. Chen; MU-CHUN WU

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