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Institution	Date	Title	Author
元智大學	Aug-20	Influence of Pd(P) Thickness on the Pd-free Solder Reaction between Eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu Multilayer	C. Y. Lee; S. P. Yang; C. H. Yang; M. K. Lu; T. T. Kuo; Cheng-En Ho
元智大學	Apr-19	In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage	C. H. Yang; S. P. Yang; B. C. Huang; C. Y. Lee; H. C. Liu; Cheng-En Ho
元智大學	2023/10/25	Electromigration Reliability of Micro Joints with Different Surface Finishes	Z. Y. Yang; S. C. Chang; C. T. Chen; W. Z. Hsieh; C. Y. Lee; H. C. Liu; K. H. Lan; P. C. Lin; Cheng-En Ho
元智大學	2023/10/25	Improving Uniformity of Electroplated Cu for TGV Metallization	Y. M. Lin; P. Y. Yeh; C. Y. Lee; K. H. Lin; C. C. Wang; Cheng-En Ho
元智大學	2022-11-18	Electromigration-induced Abnormal Phase Transformation and Massive IMC Propagation in Micro Joints	C. Y. Lee; Y. C. Chiang; C. T. Chen; Cheng-En Ho
元智大學	2022-10-26	Electromigration Reliability of Micro Joints with Au/Pd(P)/Ni(P)/Cu Pads	C. Y. Lee; S. C. Chang; C. T. Chen; H. C. Liu; K. H. Lan; P C. Lin; Cheng-En Ho
元智大學	2021/5/12	White X-ray Nanodiffraction Study of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5	P. T. Lee; W. Z. Hsieh; C. Y. Lee; C. R. Kao; Cheng-En Ho
元智大學	2021/12/21	Microstructure Modification of Copper Interconnects and Their Transmission Losses at 1–40 GHz	C. Y. Lee; S. Kao; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/12/21	Crystal Coherency between Electroplated Cu Fillings and Substrate in A Stacked-via Structure	Y. M. Lin; H. C. Liu; C. Y. Lee; C. S. Hsieh; K. H. Lan; P. C. Lin; Cheng-En Ho
元智大學	2021/12/21	Microstructure Modification of Copper Interconnects and Their Transmission Losses at 1–40 GHz	C. Y. Lee; S. Kao; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/12/21	3D Electromagnetic Simulation and VNA Measurements of Signal Transmission Loss of Cu Interconnects at 1–100 GHz: Surface Finish Effect	C. J. Yu; H. W. Tseng; S. Kao; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/12/21	3D Electromagnetic Simulation and VNA Measurements of Signal Transmission Loss of Cu Interconnects at 1–100 GHz: Surface Finish Effect	C. J. Yu; H. W. Tseng; S. Kao; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Electromagnetic Simulation and VNA Measurements of Surface Finish Effect on the Cu Interconnect Transmission Characteristics at 1–100 GHz	J. C. Yu; H. W. Tseng; C. Y. Lee; P. C. Hsu; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Improvement of High-frequency Transmission Performance through Copper Microstructure Modification	C. Y. Lee; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Electromagnetic Simulation and VNA Measurements of Surface Finish Effect on the Cu Interconnect Transmission Characteristics at 1–100 GHz	J. C. Yu; H. W. Tseng; C. Y. Lee; P. C. Hsu; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	COMSOL-Multiphysics Simulation of Current Density and Electrolyte Distributions in Cu Pillar Fabrication	P. T. Lee; C. H. Chang; C. Y. Lee; Y. L. Chen; Cheng-En Ho
元智大學	2021/11/13	Improvement of High-frequency Transmission Performance through Copper Microstructure Modification	C. Y. Lee; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2020/11/7	Thermal Stability and Electrochemical Corrosion of ENEPIG Surface Finish Deposited on the Cu Traces	C. Y. Lee; W. Z. Hsieh; P. T. Lee ; C. H. Li; S. P. Yang; Cheng-En Ho
元智大學	2020/11/7	Microstructure Modification of Copper Interconnects and Its Elongation at Break	C. Y. Lee; C. P. Pan; Y. M. Lin; Y. C. Chiang; Cheng-En Ho
元智大學	2020/11/7	Morphological Transition of Cu6Sn5 and Cu3Sn Induced by Surface Finish and Its Mechanical Reliability of Solder Joints	C. H. Li; C. Y. Lee; S. P. Yang; C. C. Chen; T. T. Kuo; Cheng-En Ho
元智大學	2020/10/21	Microstructure Modification of Fine Copper Lines and Mechanical Reliability	C. Y. Lee; C. P. Pan; P. T. Lee; Y. C. Chiang; H. C. Liu; P. C. Lin; Cheng-En Ho
元智大學	2020/10/21	Electromagnetic Properties of Ni(P) and Its Signal Transmission Performance in 5G Communication Applications	W. L. Chou; H. W. Tseng; C. J. Yu; C. Y. Lee; Huei-Ru Fuh; T. T. Kuo; Chien-Chang Huang; Cheng-En Ho
元智大學	2020/10/21	Effects of Surface Finish on the Intermetallic Compound Formation and Mechanical Reliability of Microelectronic Solder Joints	C. H. Li; S. P. Yang; C. Y. Lee; C. C. Chen; T. T. Kuo; Cheng-En Ho
元智大學	2020/10/21	Electromagnetic Properties of Ni(P) and Its Signal Transmission Performance in 5G Communication Applications	W. L. Chou; H. W. Tseng; C. J. Yu; C. Y. Lee; Huei-Ru Fuh; T. T. Kuo; Chien-Chang Huang; Cheng-En Ho
臺大學術典藏	2020-08-18T06:57:19Z	Tropical Cyclone - Ocean interaction in Typhoon Fanapi (2010) - A synergy study based on ITOP observations, EnKF data assimilation, and coupled atmosphere-ocean models	Sung, S.-L.; C.-C. Wu; I. I. Lin; S.-S. Chen; C.-Y. Lee; Sung, S.-L.; C.-C. Wu; I. I. Lin; S.-S. Chen; C.-Y. Lee; CHUN-CHIEH WU
元智大學	2019/11/15	White X-ray Laue Diffraction Characterization of Microstructure Transition and Stress Relaxation of Electroplating Cu upon Self-annealing	Y. H. Huang; W. Z. Hsieh; C. Y. Lee; C. H. Yang; S. J. Chiu; C. S. Ku; Cheng-En Ho
元智大學	2019/11/15	Nano-XRF and X-ray Nanodiffraction Studies on the Working Mechanism of Flexible Ni(P) Thin Films	W. L. Chou; C. Y. Lee; P. T. Lee; W. Z. Hsieh; C. S. Ku; X. Y. Li; S. C. Tseng; M. T. Tang; Cheng-En Ho
元智大學	2019/11/15	Microstructure Modification of Electroplating Cu and Improvement of Its Etching Characteristics in MEC Roughening Treatment	P. C. Lin; C. Y. Lee; C. H. Chang; H. C. Liu; Cheng-En Ho
元智大學	2019/11/15	Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz	W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/11/15	White X-ray Laue Diffraction Characterization of Microstructure Transition and Stress Relaxation of Electroplating Cu upon Self-annealing	Y. H. Huang; W. Z. Hsieh; C. Y. Lee; C. H. Yang; S. J. Chiu; C. S. Ku; Cheng-En Ho
元智大學	2019/11/15	Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz	W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/11/15	Nano-XRF and X-ray Nanodiffraction Studies on the Working Mechanism of Flexible Ni(P) Thin Films	W. L. Chou; C. Y. Lee; P. T. Lee; W. Z. Hsieh; C. S. Ku; X. Y. Li; S. C. Tseng; M. T. Tang; Cheng-En Ho
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Cheng-En Ho; Chien-Chang Huang; Y. S. Wu; W. L. Chou; C. J. Yu; C. Y. Lee; C. S. Chen
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Cheng-En Ho; Chien-Chang Huang; Y. S. Wu; W. L. Chou; C. J. Yu; C. Y. Lee; C. S. Chen
元智大學	2019/10/23	Roughness Effect of Cu Interconnects on Signal Transmission Performance in 5G Communication Applications	W. L. Chou; Y. S. Wu; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/10/23	Roughness Effect of Cu Interconnects on Signal Transmission Performance in 5G Communication Applications	W. L. Chou; Y. S. Wu; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Y. S. Wu; C. J. Yu; W. L. Chou; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/10/23	Microstructure Modification of Electroplating Cu and Improvement of Its Etching Characteristics in the Roughening Process	C. Y. Lee; P. C. Lin; C. H. Yang; H. C. Liu; K. H. Lan; Cheng-En Ho
元智大學	2019/10/23	Effect of Surface Finish on Signal Loss of Cu Interconnects in 5G High-frequency Transmission	Y. S. Wu; C. J. Yu; W. L. Chou; C. Y. Lee; C. S. Chen; Chien-Chang Huang; Cheng-En Ho
臺大學術典藏	2019-11-29T02:56:40Z	Isotopic perspectives of dietary patterns in Taiwan after the introduction of crops	C. Y. Lee; M. L. Chen; MU-CHUN WU
元智大學	2018-10-24	Innovative MEA Fabrication for Proton Exchange Membrane Water Electrolysis	J.W. Yu; Guo-Bin Jung; C.C. Yeh; M.Y. Kan; C.Y. Lee; C.J. Lai
臺大學術典藏	2018-09-10T15:26:18Z	Buoyancy-Activated Cell Sorting Using Targeted Biotinylated Albumin Microbubbles	Y.-R. Liou;Y.-H. Wang;C.-Y. Lee;P.-C. Li; Y.-R. Liou; Y.-H. Wang; C.-Y. Lee; P.-C. Li; PAI-CHI LI
臺大學術典藏	2018-09-10T15:00:45Z	Automatic conformal ultrasound scanning for breast cancer screening	C.-Y. Lee;T. T. Loc;P.-C. Li; C.-Y. Lee; T. T. Loc; P.-C. Li; PAI-CHI LI
臺大學術典藏	2018-09-10T15:00:14Z	Removing rain and snow in a single image using saturation and visibility feature	S. C. Pei;Y. T. Tsai;C. Y. Lee; S. C. Pei; Y. T. Tsai; C. Y. Lee; SOO-CHANG PEI
臺大學術典藏	2018-09-10T09:51:00Z	Automatic Conformal Scanning for Ultrasound Screening	C.-Y. Lee;T.-L.Truong;P.-C. Li; C.-Y. Lee; T.-L.Truong; P.-C. Li; PAI-CHI LI
臺大學術典藏	2018-09-10T09:50:59Z	Application of Targeted Biotinylated Albumin Microbubbles on Buoyancy Activated Cell Sorting	Y.-R. Liou;Y.-H. Wang;C.-Y. Lee;P.-C. Li; Y.-R. Liou; Y.-H. Wang; C.-Y. Lee; P.-C. Li; PAI-CHI LI
臺大學術典藏	2018-09-10T09:50:59Z	Isolating Cancer Cells with Targeted Biotinylated Albumin Microbubbles	Y.-R. Liou;Y.-H. Wang;C.-Y. Lee;P.-C. Li; Y.-R. Liou; Y.-H. Wang; C.-Y. Lee; P.-C. Li; PAI-CHI LI
臺大學術典藏	2018-09-10T09:25:39Z	Automatic Conformal Scanning for 3D Image	C.-Y. Lee;P.-C. Li; C.-Y. Lee; P.-C. Li; PAI-CHI LI
臺大學術典藏	2018-09-10T08:18:51Z	Dispersion-activated Wide-range temperature operation on quasi-phase-Matching green lasers with high single-pass conversion efficiency	C.-W. Liu;C.-S. Wen;C.-Y. Chu;C.-Y. Lee;L.-H. Peng;C.-L. Chen;W.-S. Wang; C.-W. Liu; C.-S. Wen; C.-Y. Chu; C.-Y. Lee; L.-H. Peng; C.-L. Chen; W.-S. Wang; LUNG-HAN PENG
臺大學術典藏	2018-09-10T07:42:43Z	Efficient Second Harmonic Blue Generation from Self-Doubling of Quasi-Phase-Matched PPLT Parametric Oscillator	I.-N. Hu;Y.-Y Lai;C. Y. Lee;L.-H. Peng;A. H. Kung; I.-N. Hu; Y.-Y Lai; C. Y. Lee; L.-H. Peng; A. H. Kung; LUNG-HAN PENG

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