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Institution	Date	Title	Author
義守大學	2011-07	Adhesion and Evaluation of Thermoplastic Nonconductive Film Materials in Flip Chip for Fine-Pitch Chip-on-Flex	Chin-Tang Hsieh;Kun-Hou Liao;Guo-Ju Chen;Chen-Mu Lee;Hung-Jan Lin;Kai-Jen Cheng

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