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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
研討會
機構典藏系統RC7版本已
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Institution Date Title Author
元智大學 2014-1-1 Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications Chin-Te Wang; Li-Han Hsu; Wei-Cheng Wu; H. T. Hsu; E. Y. Chang; Yin-Chu Hu; Ching-Ting Lee; Szu-Ping Tsai
元智大學 2014-1-1 Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications Chin-Te Wang; Li-Han Hsu; Wei-Cheng Wu; H. T. Hsu; E. Y. Chang; Yin-Chu Hu; Ching-Ting Lee; Szu-Ping Tsai
元智大學 2014-1-1 Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications Chin-Te Wang; Li-Han Hsu; Wei-Cheng Wu; H. T. Hsu; E. Y. Chang; Yin-Chu Hu; Ching-Ting Lee; Szu-Ping Tsai
元智大學 2011-10 V-Band Flip-Chip Assembled Gain Block Using In0.6Ga0.4As Metamorphic High-Electron-Mobility Transistor Technology Che-Yang Chiang; Heng-Tung Hsu; Chin-Te Wang; Chien-I Kuo; Heng-Shou Hsu; Edward Yi Chang
元智大學 2011-09 Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto
元智大學 2011-09 Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto
元智大學 2011-02 A Flip-Chip Packaged 80-nm In0.7Ga0.3As MHEMT for Millimeter-Wave Low-Noise Applications Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Che-Yang Chiang; Suz-Ping Tsai; Guo-Wei Huang
元智大學 2011-02 A Flip-Chip Packaged 80-nm In0.7Ga0.3As MHEMT for Millimeter-Wave Low-Noise Applications Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Che-Yang Chiang; Suz-Ping Tsai; Guo-Wei Huang
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang
元智大學 2010-09 Evaluation of InAs-based HEMTs for Future Energy-Efficient and Logic Applications Chien-I Kuo; Heng-Tung Hsu; Chin-Te Wang; Edward Yi Chang
元智大學 2010-09 Evaluation of InAs-based HEMTs for Future Energy-Efficient and Logic Applications Chien-I Kuo; Heng-Tung Hsu; Chin-Te Wang; Edward Yi Chang

Showing items 1-13 of 13  (1 Page(s) Totally)
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