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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:44:33Z |
Effect of aluminum seed layer on the crystallographic texture and electromigration resistance of physical vapor deposited copper interconnect
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Chin, YL; Chiou, BS; Wu, WF |
| 國立交通大學 |
2014-12-08T15:42:26Z |
Effect of the tantalum barrier layer on the electromigration and stress migration resistance of physical-vapor-deposited copper interconnect
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Chin, YL; Chiou, BS; Wu, WF |
| 國立交通大學 |
2014-12-08T15:40:02Z |
Effects of underlayer dielectric on the thermal characteristics and electromigration resistance of copper interconnect
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Chin, YL; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:26:43Z |
A fair scheduling algorithm with adaptive compensation in wireless networks
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Wang, KC; Chin, YL |
Showing items 1-4 of 4 (1 Page(s) Totally)
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