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Showing items 1-5 of 5 (1 Page(s) Totally)
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| 國立交通大學 |
2020-02-02T23:55:34Z |
Phone-nomenon: A System-Level Thermal Simulator for Handheld Devices
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Chiou, Hong-Wen; Lee, Yu-Min; Shiau, Shin-Yu; Pan, Chi-Wen; Chen, Tai-Yu |
| 國立交通大學 |
2020-02-02T23:55:34Z |
Multi-Angle Bended Heat Pipe Design Using X-Architecture Routing with Dynamic Thermal Weight on Mobile Devices
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Hsiao, Hsuan-Hsuan; Chiou, Hong-Wen; Lee, Yu-Min |
| 國立交通大學 |
2019-10-05T00:09:47Z |
Learning Based Mesh Generation for Thermal Simulation in Handheld Devices with Variable Power Consumption
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Lo, Wen-Sheng; Chiou, Hong-Wen; Hsu, Shih-Chieh; Lee, Yu-Min; Cheng, Liang-Chia |
| 國立交通大學 |
2018-08-21T05:56:59Z |
Thermal Modeling and Design on Smartphones with Heat Pipe Cooling Technique
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Chiou, Hong-Wen; Lee, Yu-Min; Hsiao, Hsuan-Hsuan; Cheng, Liang-Chia |
| 國立交通大學 |
2018-01-24T07:35:37Z |
晶片層級在高效能多核心晶片及系統層級在手持式裝置熱分析
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邱鴻文; 李育民; Chiou, Hong-Wen; Lee, Yu-min |
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