|
English
|
正體中文
|
简体中文
|
总笔数 :2828147
|
|
造访人次 :
32125125
在线人数 :
1443
教育部委托研究计画 计画执行:国立台湾大学图书馆
|
|
|
"chiu tsung chieh"的相关文件
显示项目 1-10 / 13 (共2页)
1 2 > >>
每页显示[10|25|50]项目
| 國立成功大學 |
2013-03 |
Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
|
Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lee, Hsin-Yi |
| 國立成功大學 |
2012-07 |
Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint
|
Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-04 |
The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2011-06-01 |
Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate
|
Jang, Wei-Luen; Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2011-01-26 |
無鉛錫銀系銲錫與銅、金電極之電遷移行為研究
|
邱琮傑; Chiu, Tsung-Chieh |
| 國立成功大學 |
2011-01-14 |
無鉛錫銀系銲錫與銅、金電極之電遷移行為研究
|
邱琮傑; Chiu, Tsung-Chieh |
| 國立成功大學 |
2009-12 |
The difference in the types of intermetallic compound formed between the cathode and anode of an Sn-Ag-Cu solder joint under current stressing
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2009-06 |
The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2008-01 |
Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2006-10-15 |
Amperometric detection of bilirubin from a micro-sensing electrode with a synthetic bilirubin imprinted poly(MAA-co-EGDMA) film
|
Syu, Mei-Jywan; Chiu, Tsung-Chieh; Lai, Chune-You; Chang, Yong-Sheun |
显示项目 1-10 / 13 (共2页)
1 2 > >>
每页显示[10|25|50]项目
|
