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Showing items 1-10 of 13 (2 Page(s) Totally)
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| 國立成功大學 |
2013-03 |
Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
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Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lee, Hsin-Yi |
| 國立成功大學 |
2012-07 |
Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint
|
Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-04 |
The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing
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Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2011-06-01 |
Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate
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Jang, Wei-Luen; Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2011-01-26 |
無鉛錫銀系銲錫與銅、金電極之電遷移行為研究
|
邱琮傑; Chiu, Tsung-Chieh |
| 國立成功大學 |
2011-01-14 |
無鉛錫銀系銲錫與銅、金電極之電遷移行為研究
|
邱琮傑; Chiu, Tsung-Chieh |
| 國立成功大學 |
2009-12 |
The difference in the types of intermetallic compound formed between the cathode and anode of an Sn-Ag-Cu solder joint under current stressing
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2009-06 |
The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint
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Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2008-01 |
Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination
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Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2006-10-15 |
Amperometric detection of bilirubin from a micro-sensing electrode with a synthetic bilirubin imprinted poly(MAA-co-EGDMA) film
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Syu, Mei-Jywan; Chiu, Tsung-Chieh; Lai, Chune-You; Chang, Yong-Sheun |
Showing items 1-10 of 13 (2 Page(s) Totally)
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