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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立成功大學 2013-03 Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lee, Hsin-Yi
國立成功大學 2012-07 Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Lai, Yi-Shao
國立成功大學 2012-04 The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing Chiu, Tsung-Chieh; Lin, Kwang-Lung
國立成功大學 2011-06-01 Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate Jang, Wei-Luen; Chiu, Tsung-Chieh; Lin, Kwang-Lung
國立成功大學 2011-01-26 無鉛錫銀系銲錫與銅、金電極之電遷移行為研究 邱琮傑; Chiu, Tsung-Chieh
國立成功大學 2011-01-14 無鉛錫銀系銲錫與銅、金電極之電遷移行為研究 邱琮傑; Chiu, Tsung-Chieh
國立成功大學 2009-12 The difference in the types of intermetallic compound formed between the cathode and anode of an Sn-Ag-Cu solder joint under current stressing Chiu, Tsung-Chieh; Lin, Kwang-Lung
國立成功大學 2009-06 The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint Chiu, Tsung-Chieh; Lin, Kwang-Lung
國立成功大學 2008-01 Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination Chiu, Tsung-Chieh; Lin, Kwang-Lung
國立成功大學 2006-10-15 Amperometric detection of bilirubin from a micro-sensing electrode with a synthetic bilirubin imprinted poly(MAA-co-EGDMA) film Syu, Mei-Jywan; Chiu, Tsung-Chieh; Lai, Chune-You; Chang, Yong-Sheun
國立成功大學 2006-07-21 以分子模版材料製備之電極進行 對膽紅素感測之探討 邱琮傑; Chiu, Tsung-Chieh
國立成功大學 2006-07-21 以分子模版材料製備之電極進行 對膽紅素感測之探討 邱琮傑; Chiu, Tsung-Chieh
國立成功大學 2005-08 Binding specificity of alpha-bilirubin-imprinted poly(methacrylic acid-co-ethylene glycol dimethylacrylate) toward alpha-bilirubin Syu, Mei-Jywan; Deng, Jing-Hong; Nian, You-Ming; Chiu, Tsung-Chieh; Wu, An-Hua

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