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"chiu wei lan"
Showing items 1-8 of 8 (1 Page(s) Totally)
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| 國立交通大學 |
2018-01-24T07:35:37Z |
三維積體電路晶片間接點之研究: Cu3Sn接點與金對金直接接合
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邱韋嵐; 陳智; Chiu, Wei-Lan; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
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Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2016-03-28T00:04:16Z |
Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures
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Chiu, Wei-Lan; Liu, Chien-Min; Haung, Yi-Sa; Chen, Chih |
| 國立交通大學 |
2015-05-12T02:59:37Z |
Electrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the same
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Chen Chih; Chiu Wei-Lan |
| 國立交通大學 |
2014-12-16T06:14:49Z |
ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF FABRICATING THE SAME, AND ELECTRICAL CONNECTING STRUCTURE COMPRISING THE SAME
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CHEN Chih; CHIU Wei-Lan |
| 國立交通大學 |
2014-12-12T01:41:09Z |
Bianchi Type I 空間宇宙模型的動態系統解析
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邱韋嵐; Chiu, Wei-Lan; 高文芳; Kao, Wen-Fang |
| 國立交通大學 |
2014-12-08T15:36:40Z |
Grain growth in electroplated (111)-oriented nanotwinned Cu
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Huang, Yi-Sa; Liu, Chien-Min; Chiu, Wei-Lan; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:36:08Z |
Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization
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Chiu, Wei-Lan; Liu, Chien-Min; Haung, Yi-Sa; Chen, Chih |
Showing items 1-8 of 8 (1 Page(s) Totally)
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