|
English
|
正體中文
|
简体中文
|
總筆數 :2822924
|
|
造訪人次 :
30016444
線上人數 :
844
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
|
|
|
"chiu wei lan"的相關文件
顯示項目 1-8 / 8 (共1頁)
1
每頁顯示[10|25|50]項目
| 國立交通大學 |
2018-01-24T07:35:37Z |
三維積體電路晶片間接點之研究: Cu3Sn接點與金對金直接接合
|
邱韋嵐; 陳智; Chiu, Wei-Lan; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
|
Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2016-03-28T00:04:16Z |
Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures
|
Chiu, Wei-Lan; Liu, Chien-Min; Haung, Yi-Sa; Chen, Chih |
| 國立交通大學 |
2015-05-12T02:59:37Z |
Electrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the same
|
Chen Chih; Chiu Wei-Lan |
| 國立交通大學 |
2014-12-16T06:14:49Z |
ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF FABRICATING THE SAME, AND ELECTRICAL CONNECTING STRUCTURE COMPRISING THE SAME
|
CHEN Chih; CHIU Wei-Lan |
| 國立交通大學 |
2014-12-12T01:41:09Z |
Bianchi Type I 空間宇宙模型的動態系統解析
|
邱韋嵐; Chiu, Wei-Lan; 高文芳; Kao, Wen-Fang |
| 國立交通大學 |
2014-12-08T15:36:40Z |
Grain growth in electroplated (111)-oriented nanotwinned Cu
|
Huang, Yi-Sa; Liu, Chien-Min; Chiu, Wei-Lan; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:36:08Z |
Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization
|
Chiu, Wei-Lan; Liu, Chien-Min; Haung, Yi-Sa; Chen, Chih |
顯示項目 1-8 / 8 (共1頁)
1
每頁顯示[10|25|50]項目
|
