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Showing items 1-11 of 11 (1 Page(s) Totally)
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| 國立成功大學 |
2014-11 |
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages
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Kao, Chin-Li; Chen, Tei-Chen; Lai, Yi-Shao; Chiu, Ying-Ta |
| 國立成功大學 |
2013-09 |
The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad
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Lin, Yu-Wei; Ke, Wun-Bin; Wang, Ren-You; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2013-02-05 |
Electrorecrystallization of Metal Alloy
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Chiu, Ying-Ta; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lai, Yi-Shao |
| 國立成功大學 |
2012-05-01 |
The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation
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Lin, Yu-Wei; Wang, Ren-You; Ke, Wun-Bin; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-02-15 |
Dissolution of Sn in a SnPb solder bump under current stressing
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Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-01-31 |
高鉛銲錫與其覆晶接點之電遷移行為研究
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邱盈達; Chiu, Ying-Ta |
| 國立成功大學 |
2012-01-12 |
高鉛銲錫與其覆晶接點之電遷移行為研究
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邱盈達; Chiu, Ying-Ta |
| 國立成功大學 |
2011-10 |
Supersaturation induced by current stressing
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Chiu, Ying-Ta; Liu, Chia-Hao; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2008-07 |
Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test
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Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2005-07-04 |
錫鋅系無鉛銲錫與基材接合反應行為研究
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邱盈達; Chiu, Ying-Ta |
| 國立成功大學 |
2005-07-04 |
錫鋅系無鉛銲錫與基材接合反應行為研究
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邱盈達; Chiu, Ying-Ta |
Showing items 1-11 of 11 (1 Page(s) Totally)
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