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Showing items 1-5 of 5 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立交通大學 |
2018-08-21T05:53:13Z |
Thermal performance evaluation of cascode Paralleled-GaN-HEMTs packaging for high power switching applications
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Chou, Hsin-Ping; Cheng, Stone |
國立交通大學 |
2018-01-24T07:42:35Z |
高功率氮化鎵元件之封裝與熱分析研究
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周歆苹; 鄭泗東; Chou, Hsin-Ping; Cheng, Stone |
國立交通大學 |
2016-03-28T00:04:06Z |
Development and characterization of the thermal behavior of packaged cascode GaN HEMTs
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Chou, Hsin-Ping; Cheng, Stone; Cheng, Chia-Hsiang; Chuang, Chia-Wei |
國立交通大學 |
2014-12-08T15:34:47Z |
In Depth Thermal Analysis of Packaged GaN on Si Power Devices
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Wang, Chieh-An; Chou, Hsin-Ping; Cheng, Stone; Chou, Po-Chien |
國立交通大學 |
2014-12-08T15:33:13Z |
Thermal Analysis and Electrical Performance of Packaged AlGaN/GaN Power HEMTs
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Chou, Po-Chien; Cheng, Stone; Chieng, Wei-Hua; Chang, E. Y.; Chou, Hsin-Ping |
Showing items 1-5 of 5 (1 Page(s) Totally) 1 View [10|25|50] records per page
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