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"chu david t"
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| 國立交通大學 |
2019-04-03T06:44:31Z |
Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
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Lin, Jie-An; Lin, Chung-Kuang; Liu, Chen-Min; Huang, Yi-Sa; Chen, Chih; Chu, David T.; Tu, King-Ning |
| 國立交通大學 |
2018-08-21T05:53:03Z |
Growth competition between layer-type and porous-type Cu3Sn in microbumps
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Chu, David T.; Chu, Yi-Cheng; Lin, Jie-An; Chen, Yi-Ting; Wang, Chun-Chieh; Song, Yen-Fang; Chiang, Cheng-Cheng; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:55:29Z |
Communication-Formation of Porous Cu3Sn by High-Temperature Current Stressing
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Lin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N. |
Showing items 1-3 of 3 (1 Page(s) Totally)
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