| 國立臺灣科技大學 |
2011 |
Highly stable carbon-doped Cu films on barrierless Si
|
Zhang, X.Y.;Li, X.N.;Nie, L.F.;Chu, J.P.;Wang, Q.;Lin, C.H.;Dong, C. |
| 國立臺灣科技大學 |
2010 |
Thermal performance of a new Cu alloy film for advanced interconnects
|
Lin C.H.; Chu J.P.; Leau W.K. |
| 國立臺灣科技大學 |
2010 |
Electrosynthesis and studies on Cadmium-Indium-Selenide thin films
|
Mahalingam T.; Thanikaikarasan S.; Chandramohan R.; Chung K.; Chu J.P.; S.velumani; Rhee J.-K. |
| 國立臺灣科技大學 |
2010 |
The preparation for Cu(Sn) films of barrierless interconnection
|
Xu L.; Li X.; Chu J.P.; Dong C. |
| 國立臺灣科技大學 |
2010 |
Sputter-deposited Cu/Cu(O) multilayers exhibiting enhanced strength and tunable modulus
|
Chu J.P.; Wang Y.-C. |
| 國立臺灣科技大學 |
2010 |
Novel Cu-RuNx composite layer with good solderability and very low consumption rate
|
Chuang H.Y.; Lin C.H.; Chu J.P.; Kao C.R. |
| 國立臺灣科技大學 |
2010 |
Effect of deposition potential on the physical properties of electrodeposited CuO thin films
|
Mahalingam T.; Dhanasekaran V.; Ravi G.; Lee S.; Chu J.P.; Lim H.-J. |
| 國立臺灣科技大學 |
2010 |
Ultrathin diffusion barrier for copper metallization: A thermally stable amorphous rare-earth scandate
|
Chu J.P.; Yu T.Y.; Wu C.H.; Lin C.H.; Wang S.F.; Chen Q. |
| 國立臺灣科技大學 |
2010 |
High thermal stability and low electrical resistivity carbon-containing Cu film on barrierless Si
|
Nie L.F.; Li X.N.; Chu J.P.; Wang Q.; Lin C.H.; Dong C. |
| 國立臺灣科技大學 |
2010 |
Thin film metallic glasses: Preparations, properties, and applications
|
Chu, J.P.;Huang, J.C.;Jang, J.S.C.;Wang, Y.C.;Liaw, P.K. |
| 國立臺灣科技大學 |
2010 |
CHARACTERIZATION OF ELECTRODEPOSITED INDIUM DOPED CdSe THIN FILMS
|
Mahalingam, T.;Mariappan, R.;Dhanasekaran, V.;Mohan, S.M.;Ravi, G.;Chu, J.P. |
| 國立臺灣科技大學 |
2010 |
Characterization of nanoindentation damage in metal/ceramic multilayered films by transmission electron microscopy (TEM)
|
Sun, P.L.;Chu, J.P.;Lin, T.Y.;Shen, Y.L.;Chawla, N. |
| 國立臺灣科技大學 |
2010 |
Indentation Behavior of Zr-Based Metallic-Glass Films via Molecular-Dynamics Simulations
|
Wang, Y.C.;Wu, C.Y.;Chu, J.P.;Liaw, P.K. |
| 國立臺灣大學 |
2010 |
Novel Cu-RuNx composite layer with good solderability and very low consumption rate
|
Chuang, H.Y.; Lin, C.H.; Chu, J.P.; Kao, C.R. |
| 國立臺灣科技大學 |
2009 |
Thermal stability study of Cu(MoN x ) seed layer on barrierless Si
|
Chu J.P.; Lin C.H.; Leau W.K.; John V.S. |
| 國立臺灣科技大學 |
2009 |
On the amorphous and nanocrystalline Zr-Cu and Zr-Ti co-sputtered thin films
|
Chen C.J.; Huang J.C.; Chou H.S.; Lai Y.H.; Chang L.W.; Du X.H.; Chu J.P.; Nieh T.G. |
| 國立臺灣科技大學 |
2009 |
Annealing-induced amorphization in a glass-forming thin film
|
Chu J.P. |
| 國立臺灣科技大學 |
2009 |
Study of the characteristics and corrosion behavior for the Zr-based metallic glass thin film fabricated by pulse magnetron sputtering process
|
Chu C.W.; Jang J.S.C.; Chiu S.M.; Chu J.P. |
| 國立臺灣科技大學 |
2009 |
Amorphous and nanocrystalline sputtered Mg-Cu thin films
|
Chou H.S.; Huang J.C.; Lai Y.H.; Chang L.W.; Du X.H.; Chu J.P.; Nieh T.G. |
| 國立臺灣科技大學 |
2009 |
Thermal Stability Study of Cu(MoNx) Seed Layer on Barrierless Si
|
Chu, J.P.;Lin, C.H.;Leau, W.K.;John, V.S. |
| 國立臺灣科技大學 |
2009 |
Cu(ReNx) for Advanced Barrierless Interconnects Stable Up To 730 degrees C
|
Chu, J.P.;Lin, C.H.;Sun, P.L.;Leau, W.K. |
| 國立臺灣科技大學 |
2009 |
Recent progress in metallic glasses in Taiwan
|
Huang, J.C.;Chu, J.P.;Jang, J.S.C. |
| 國立臺灣科技大學 |
2009 |
Electrical and Reliability Characteristics of Barrierless Cu-Based Contact for High Dielectric Constant Oxide Thin-Film Device Integration
|
Wu, C.H.;Chu, J.P.;Lin, C.H.;Wang, S.F. |
| 國立臺灣科技大學 |
2008 |
High performance Cu containing Ru or RuNX for barrierless metallization
|
Chu J.P.; Lin C.H. |
| 國立臺灣科技大學 |
2008 |
Novel CU alloy seed layers for barrierless metallization
|
Chu J.P.; Lin C.H. |
