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Showing items 1-6 of 6 (1 Page(s) Totally)
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| 國立成功大學 |
2004-08 |
Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test
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Liu, Yeh-Hsiu; Chuang, Chiang-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2004-01 |
The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates
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Chuang, Chiang-Ming; Hung, Hui-Tzu; Liu, Pei-Chi; Lin, Kwang-Lung |
| 國立成功大學 |
2003-12 |
Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate
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Chuang, Chiang-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2003-01 |
Mechanical strength of Sn-3.5Ag-based solders and related bondings
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Chuang, Chiang-Ming; Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2002-01 |
Effect of aluminum addition on tensile properties of naturally aged Sn-9Zn eutectic solder
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Chuang, Chiang-Ming; Lui, Truan-Sheng; Chen, Li-Hui |
| 國立成功大學 |
2001-09 |
Effect of lead content on vibration fracture behavior of Pb-Sn eutectic solder
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Chuang, Chiang-Ming; Lui, Truan-Sheng; Chen, Li-Hui |
Showing items 1-6 of 6 (1 Page(s) Totally)
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