|
English
|
正體中文
|
简体中文
|
總筆數 :2856753
|
|
造訪人次 :
53857660
線上人數 :
1086
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
|
|
|
"chuang h y"的相關文件
顯示項目 66-75 / 89 (共9頁)
<< < 1 2 3 4 5 6 7 8 9 > >>
每頁顯示[10|25|50]項目
| 國立東華大學 |
2007 |
The Effect of Low Temperature Solute Elements on Nonequilibrium Eutectic Solidification of Sn-Ag Eutectic Solder
|
Song,J. M.; Wu,Z. M.; Chuang,H. Y.; Huang,D. A. |
| 國立東華大學 |
2007 |
Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High Temperature Soldering Applications
|
Song,J. M.; Chuang,H. Y.; Wu,Z. M. |
| 國立東華大學 |
2007 |
Thermal and Tensile Properties of Bi-Ag Alloy
|
Song,J. M.; Chuang,H. Y.; Wen,T. X. |
| 國立東華大學 |
2007 |
Microstructural Characteristics and Vibration Fracture Properties of Al-Mg-Si Alloys with Excess Cu and Ni
|
Song,J. M.; Lin,T. Y.; Chuang,H. Y. |
| 國立臺灣科技大學 |
2007 |
A real-time NURBS motion interpolator for position control of a slide equilateral triangle parallel manipulator
|
Chuang, H.-Y.;Chien, K.-H. |
| 國立成功大學 |
2006-10 |
Once-daily vs. twice-daily intrapleural urokinase treatment of complicated parapneumonic effusion in paediatric patients: a randomised, prospective study
|
Wang, J. N.; Yao, C. T.; Yeh, C. N.; Liu, C. C.; Wu, M. H.; Chuang, H. Y.; Wu, Jing-Ming |
| 國立東華大學 |
2006-07 |
Interfacial Behaviour between Bi-Ag based Solders and Ni substrate
|
Song,J. M.; Chuang,H. Y. |
| 國立東華大學 |
2006 |
Microstructural Characteristics and Vibration Fracture Properties of Sn-Ag-Cu-TM (TM=Co, Ni and Zn) Alloys
|
Song,J. M.; Huang,C. F.; Chuang, H. Y. |
| 國立東華大學 |
2006 |
Interfacial Reactions between Bi-Ag High Temperature Solders and Metallic Substrates
|
Song,J. M.; Chuang,H. Y.; Wu,Z. M. |
| 國立東華大學 |
2006 |
Sedimentation of Intermetallics in Liquid Lead-free Solders
|
Song,J. M.; Chuang, H. Y.; Shen,Y. L. |
顯示項目 66-75 / 89 (共9頁)
<< < 1 2 3 4 5 6 7 8 9 > >>
每頁顯示[10|25|50]項目
|
