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Institution	Date	Title	Author
國立臺灣大學	2012	3D IC 封裝中接點空間受限誘發之界面反應關鍵效應	莊鑫毅; Chuang, Hsin-Yi
國立東華大學	2007	Electrical resistivity and interfacial behavior of Bi-Ag/Cu high temperature solder joints	Song,J. M.; Chuang,Hsin-Yi; Lew,Kar-Kit

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