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Showing items 136-145 of 384 (39 Page(s) Totally)
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| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Characterization of thin films and intermetallic compounds in solder joint
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Tsai, I.; Tai, L.J.; Yen, S.F.; Chuang, T.H.; Lo, R.; Ku, T.; Wu, E.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Reflow and Burn-in of a Sn-20ln-0.8Cu Ball Grid Array Package with a Au/Ni/Cu Pad
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Chuang, T.H.; TUNG-HAN CHUANG; Chang, S.Y.; Chiang, M.J. |
| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packages
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Cheng, M.D.; Yen, S.F.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package
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Chuang, T.-H.; Yen, S.-F.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads
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TUNG-HAN CHUANG; Chuang, T.-H.; Lin, H.-J. |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al 2O3 and Cu/Ti/Si with Sn/In interlayer
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Chuang, T.-H.; Lin, H.-J.; Tsao, C.-W.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
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Wang, S.S.; Tseng, Y.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Mechanical properties of intermetallic compounds on lead-free solder by moiré techniques
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TUNG-HAN CHUANG; Chuang, T.H.; Yen, S.F.; Wu, E.; Tsai, I. |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
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Liu, Y.U.-C.; Lin, W.-H.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:13Z |
Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy
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Chuang, T.H.; Lin, H.J.; Chi, C.C.; TUNG-HAN CHUANG |
Showing items 136-145 of 384 (39 Page(s) Totally)
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