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Showing items 141-150 of 384 (39 Page(s) Totally)
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| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al 2O3 and Cu/Ti/Si with Sn/In interlayer
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Chuang, T.-H.; Lin, H.-J.; Tsao, C.-W.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
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Wang, S.S.; Tseng, Y.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Mechanical properties of intermetallic compounds on lead-free solder by moiré techniques
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TUNG-HAN CHUANG; Chuang, T.H.; Yen, S.F.; Wu, E.; Tsai, I. |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
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Liu, Y.U.-C.; Lin, W.-H.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:13Z |
Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy
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Chuang, T.H.; Lin, H.J.; Chi, C.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:13Z |
Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints
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Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:13Z |
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
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Chuang, T.-H.; Yen, S.-F.; Wu, H.-M.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:13Z |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
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Chuang, T.H.; Yen, S.F.; Cheng, M.D.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal
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Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Enhanced growth of anodic alumina nanochannels on Ga-ion pre-irradiated aluminum
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TUNG-HAN CHUANG; Liu, C.Y.; Datta, A.; Liu, N.W.; Wu, Y.R.; Wang, H.H.; Chuang, T.H.; Wang, Y.L. |
Showing items 141-150 of 384 (39 Page(s) Totally)
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